Low-loss LIGA-fabricated coplanar waveguide and filter

Author(s):  
Michael A. Forman
Keyword(s):  
2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000191-000198 ◽  
Author(s):  
A. Isapour ◽  
D. Bahloul ◽  
A. B. Kouki

Abstract The wireless telecommunication systems have an undeniable role in today's society. The rapid progress of wireless services and applications accelerates demands for high data-rate reliable systems. The 60 GHz band with its 5 GHz globally unlicensed available spectrum, provides a great opportunity for the next generation of high data-rate wireless communication. Despite this attractive bandwidth surrounding 60 GHz, there are still many challenges to be addressed such as the loss performance and the integration with other systems. Low Temperature Cofired Ceramic (LTCC) technology, with its unique and mature multilayer fabrication process, has excellent capability of realizing miniaturized 3D low loss structures to overcome these challenges. Since, one of the key components in any communication system for both interconnecting and designing components is Low loss transmission lines, in this article we overview the performances and challenges for four different most practical transmission lines at 60 GHz in LTCC: Microstrip, Stripline, Coplanar Waveguide (CPW), and LTCC Integrated Waveguide (LIW).


2011 ◽  
Vol 2011 (CICMT) ◽  
pp. 000050-000053
Author(s):  
Alexander Schulz ◽  
Sven Rentsch ◽  
Lei Xia ◽  
Robert Mueller ◽  
Jens Mueller

This paper presents a low loss fully embedded bandpass filter (BPF) using low temperature co-fired ceramic (LTCC) for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications for the unlicensed 60 GHz band. The measured insertion loss was 1.5 dB at the center frequency 58 GHz, and a return loss of less than −10 dB was achieved, including two grounded coplanar waveguide transmission line (CPWg) to stripline transitions. The four layers BPF has a 3 dB bandwidth of about 11 GHz which supplies e.g. broadband and high data rate applications. The whole BPF requires a substrate area of 5.6 × 2.1 × 0.42 mm3 with transitions and a shielding via fence. This BPF suits well for V-band applications in a LTCC package because of the compact dimensions and the good performance.


2018 ◽  
Vol 15 (3) ◽  
pp. 101-106
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This article outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully printed, highly integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an integrated circuit (IC) die are presented using printed dielectric ramps and coplanar waveguide transmission lines exhibiting low loss (.6–.8 dB/mm at 40 GHz). Stereolithography 3D printing is presented for the encapsulation of IC dice, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface–based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulant, or through mold vias, achieving a slope of up to 65° and low loss (.5–.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


2017 ◽  
Vol 2017 (1) ◽  
pp. 000252-000257 ◽  
Author(s):  
Bijan K. Tehrani ◽  
Ryan A. Bahr ◽  
Manos M. Tentzeris

Abstract This paper outlines the design, processing, and implementation of inkjet and 3D printing technologies for the development of fully-printed, highly-integrated millimeter-wave (mm-wave) wireless packages. The materials, tools, and processes of each technology are outlined and justified for their respective purposes. Inkjet-printed 3D interconnects directly interfacing a packaging substrate with an IC die are presented using printed dielectric ramps and coplanar waveguide (CPW) transmission lines exhibiting low loss (0.6–0.8 dB/mm at 40 GHz). Stereolithography (SLA) 3D printing is presented for the encapsulation of IC dies, enabling the application-specific integration of on-package structures, including dielectric lenses and frequency selective surface (FSS)-based wireless filters. Finally, inkjet and 3D printing technology are combined to present sloped mm-wave interconnects through an encapsulation, or through-mold vias (TMVs), achieving a slope up to 65° and low loss (0.5–0.6 dB/mm at 60 GHz). The combination of these additive techniques is highlighted for the development of scalable, application-specific wireless packages.


2009 ◽  
Vol 30 (7) ◽  
pp. 074004 ◽  
Author(s):  
Zhao Yuhang ◽  
Tong Jiarong ◽  
Zeng Xuan ◽  
Wang Yong
Keyword(s):  

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Guohua Zhai ◽  
Yong Cheng ◽  
Qiuyan Yin ◽  
Shouzheng Zhu ◽  
Jianjun Gao

A uniplanar millimeter-wave broadband printed log-periodic dipole array (PLPDA) antenna fed by coplanar waveguide (CPW) is introduced. This proposed structure consists of several active dipole elements, feeding lines, parallel coupled line, and the CPW, which are etched on a single metallic layer of the substrate. The parallel coupled line can be optimized to act as a transformer between the CPW and the PLPDA antenna. Meanwhile, this transform performs the task of a balun to achieve a wideband, low cost, low loss, simple directional antenna. The uniplanar nature makes the antenna suitable to be integrated into modern printed communication circuits, especially the monolithic millimeter-wave integrated circuits (MMIC). The antenna has been carefully examined and measured to present the return loss, far-field patterns, and antenna gain.


2010 ◽  
Vol 97 (23) ◽  
pp. 232509 ◽  
Author(s):  
M. R. Vissers ◽  
J. Gao ◽  
D. S. Wisbey ◽  
D. A. Hite ◽  
C. C. Tsuei ◽  
...  

2021 ◽  
Vol 119 (13) ◽  
pp. 132601
Author(s):  
D. Kowsari ◽  
K. Zheng ◽  
J. T. Monroe ◽  
N. J. Thobaben ◽  
X. Du ◽  
...  

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