Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading — Part III: Material properties and package geometries
1998 ◽
Vol 21
(4)
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pp. 407-412
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1997 ◽
Vol 20
(2)
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pp. 176-183
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Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading
1996 ◽
Vol 19
(3)
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pp. 593-600
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2000 ◽
Vol 23
(3)
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pp. 554-560
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2011 ◽
Vol 9
(4)
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pp. 395-408
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Keyword(s):
1996 ◽
Vol 60
(6)
◽
pp. 1067-1077
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1974 ◽
Vol 14
(01)
◽
pp. 19-24
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Keyword(s):
1999 ◽
Vol 65
(632)
◽
pp. 909-916