Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. II. Using alloy 42 as leadframe material
1997 ◽
Vol 20
(2)
◽
pp. 176-183
◽
1998 ◽
Vol 21
(4)
◽
pp. 407-412
◽
Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading
1996 ◽
Vol 19
(3)
◽
pp. 593-600
◽
1996 ◽
Vol 60
(6)
◽
pp. 1067-1077
◽
1969 ◽
Vol 184
(2)
◽
pp. 95-100