Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading-Part II: Material properties and package geometry factors

2000 ◽  
Vol 23 (3) ◽  
pp. 554-560 ◽  
Author(s):  
T. Saitoh ◽  
H. Matsuyama ◽  
M. Toya
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