Energy based methodology for damage and life prediction of solder joints under thermal cycling

1994 ◽  
Vol 17 (4) ◽  
pp. 626-631 ◽  
Author(s):  
V. Sarihan
Keyword(s):  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

2020 ◽  
Vol 37 (4) ◽  
pp. 165-171
Author(s):  
Dongbo Li ◽  
Jianpei Wang ◽  
Bing Yang ◽  
Yongle Hu ◽  
Ping Yang
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Load Spectrum ◽  
Thermal Reliability ◽  
Joint Stress ◽  
Content Type ◽  
Fatigue Characteristics

Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided. Design/methodology/approach The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions. Findings The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring. Originality/value This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.

Life Prediction of SMT Solder Joints under Thermal Cycling

1994 ◽  
Vol 6 (1) ◽  
pp. 31-50 ◽  
Author(s):  
J.H. Huang ◽  
J.Y. Pei ◽  
Y.Y. Qian ◽  
Y.H. Jiang
Keyword(s):  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

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