Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards

1998 ◽  
Vol 21 (1) ◽  
pp. 142-153 ◽  
Author(s):  
N.V. Queipo ◽  
J.A.C. Humphrey ◽  
A. Ortega
Keyword(s):  
Optimal Placement ◽  
Printed Wiring Boards ◽  
Electronic Components

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

1999 ◽  
Vol 122 (2) ◽  
pp. 152-159 ◽  
Author(s):  
Nestor V. Queipo ◽  
Guy F. Gil
Keyword(s):  
Heat Transfer ◽  
Genetic Algorithm ◽  
Optimal Placement ◽  
Printed Wiring Boards ◽  
Multiattribute Utility ◽  
Utility Analysis ◽  
Electronic Components ◽  
Multiattribute Utility Analysis ◽  
Solution Methodology

This paper presents a solution methodology for the optimal placement of convectively and conductively air-cooled electronic components on planar printed wiring boards considering thermal and electrical/cost design objectives. The methodology combines the use of a heat transfer solver for the prediction of the temperature distribution among the electronic components and a genetic algorithm for the adaptive search of optimal or near optimal solutions and a multiobjective optimization strategy (Pareto optimization and multiattribute utility analysis). After proper validation of the elements of the solution methodology (heat transfer solver/genetic algorithm) in isolation, the methodology under consideration is tested using a placement problem (case study) that considers as optimization criteria the minimization of an estimate of the failure rate of the system of components due to thermal overheating (via an Arrhenius relation) and the minimization of the total wiring length given some interconnectivity requirements. Results corresponding to the case study are presented and discussed for both Pareto optimization and multiattribute utility analysis. [S1043-7398(00)00801-X]

scholarly journals The use of fractional calculus for the optimal placement of electronic components on a linear array

2015 ◽  
Vol 28 (1) ◽  
pp. 77-84
Author(s):  
Mey de ◽  
Mariusz Felczak ◽  
Bogusław Więcek
Keyword(s):  
Integral Equation ◽  
Fractional Calculus ◽  
Forced Convection ◽  
Linear Array ◽  
The Other ◽  
Simple Solution ◽  
Optimal Placement ◽  
Critical Component ◽  
Electronic Components ◽  
One Dimensional

Cooling of heat dissipating components has become an important topic in the last decades. Sometimes a simple solution is possible, such as placing the critical component closer to the fan outlet. On the other hand this component will heat the air which has to cool the other components further away from the fan outlet. If a substrate bearing a one dimensional array of heat dissipating components, is cooled by forced convection only, an integral equation relating temperature and power is obtained. The forced convection will be modelled by a simple analytical wake function. It will be demonstrated that the integral equation can be solved analytically using fractional calculus.

Laser Processing of Parmod™ Functional Electronic Materials

2000 ◽  
Vol 624 ◽  
Author(s):  
Paul H. Kydd ◽  
David L. Richard ◽  
Douglas B. Chrisey ◽  
Kenneth H. Church
Keyword(s):  
Laser Processing ◽  
Electronic Materials ◽  
Health And Safety ◽  
Thermal Curing ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Additive Process ◽  
Safety Issues ◽  
Flexible Polymer ◽  
Conventional Plate

ABSTRACTParmod™ is a family of materials that can be printed and thermally cured to create metallic conductors on printed wiring boards. This additive process provides a way to produce circuitry direct from CAD files without the necessity for intermediate tooling of any kind. The printed images are converted to pure metallic traces in seconds at a temperature low enough to be compatible with commonly used rigid and flexible polymer-based substrates. This simple, two-step process eliminates the hazardous wastes and employee health and safety issues associated with conventional plate-and-etch photolithographic technologyRecently the Parmod™ technology has been extended from metals to oxides to enable printing passive electronic components such as resistors, capacitors and inductors, as well as the metallic interconnects. While thermal curing of the oxides provides useable electronic properties, particularly of resistors and capacitors, the performance of all these novel materials could be improved by laser processing. This paper discusses preliminary results on laser processing of Parmod™ conductors and components in two different systems

scholarly journals Assessing iMET-XQ Performance and Optimal Placement on a Small Off-the-Shelf, Rotary-Wing UAV, as a Function of Atmospheric Conditions

Atmosphere ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 660 ◽  
Author(s):  
Sytske K. Kimball ◽  
Carlos J. Montalvo ◽  
Madhuri S. Mulekar
Keyword(s):  
Atmospheric Temperature ◽  
The Body ◽  
Temperature Measurements ◽  
Optimal Placement ◽  
Atmospheric Conditions ◽  
Electronic Components ◽  
Multiple Sensors ◽  
Accuracy And Precision ◽  
Rotary Wing ◽  
Body Heat

The accuracy and precision of iMET-XQ (InterMET Inc., Grand Rapids, MI, USA) temperature measurements in ten different locations on an off-the shelf rotary-wing unmanned aerial vehicle (rw-UAV) were assessed, as a function of atmospheric conditions. The rw-UAV hovered near an instrumented South Alabama Mesonet tower. The mean ± standard deviation of all the temperature differences between the tower and the ten iMET-XQ sensors for all experiments are −0.23 °C ±0.24 °C. Both the UAV and the environment influence the accuracy and precision of the iMET-XQ temperature measurements. Heat generated by the electronic components within the UAV body has a significant influence on the iMET-XQ temperature measurements, regardless of solar radiation conditions, and is highly dependent on wind direction. Electronic components within the UAV body heat up and can cause sensors downwind from the UAV body to record temperatures that are too warm, even if the sensors are aspirated by propeller wash. iMET-XQ sensors placed on rotor arms not near UAV body heat sources, and properly aspirated by propeller wash, perform well. Measurements from iMET-XQ sensors suspended below the UAV are also accurate. When using an off-the-shelf UAV for atmospheric temperature sensing, the electronic components inside the body of the UAV must be properly located. It is recommended that multiple sensors are placed on the UAV. Sensor redundancy will mitigate data loss in case of malfunction during flight and the identification of poorly performing sensors.

scholarly journals A model for the convective cooling of electronic components with application to optimal placement

1991 ◽  
Vol 15 (2) ◽  
pp. 59-75 ◽  
Author(s):  
B. Cahlon ◽  
I. Gertsbakh ◽  
I.E. Schochetman ◽  
M. Shillor
Keyword(s):  
Optimal Placement ◽  
Electronic Components ◽  
Convective Cooling

Optimal Placement of Electronic Components to Minimize Heat Flux Nonuniformities

2011 ◽  
Vol 48 (4) ◽  
pp. 556-563 ◽  
Author(s):  
Derek W. Hengeveld ◽  
James E. Braun ◽  
Eckhard A. Groll ◽  
Andrew D. Williams
Keyword(s):  
Heat Flux ◽  
Optimal Placement ◽  
Electronic Components
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