Classification of shapes of electronic components for placement on printed wiring boards

2015 ◽  
Keyword(s):  
Printed Wiring Boards ◽  
Electronic Components

ELECTRONIC COMPONENT BASE MODERN MANAGEMENT ROAD TRANSPORT SYSTEM

2015 ◽  
Vol 2 (2) ◽  
pp. 803-806
Author(s):  
Новикова ◽  
Tatyana Novikova
Keyword(s):  
Transport System ◽  
Road Transport ◽  
Electronic Component ◽  
Electronic Systems ◽  
Electronic Components ◽  
Modern Management ◽  
Controls Systems

The article discusses trends and scope of electronic components in the vehicle controls systems that address some classification of the vehicle electronics, designated the requirements for electronic component base, used in the car electronic systems

Laser Processing of Parmod™ Functional Electronic Materials

2000 ◽  
Vol 624 ◽  
Author(s):  
Paul H. Kydd ◽  
David L. Richard ◽  
Douglas B. Chrisey ◽  
Kenneth H. Church
Keyword(s):  
Laser Processing ◽  
Electronic Materials ◽  
Health And Safety ◽  
Thermal Curing ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Additive Process ◽  
Safety Issues ◽  
Flexible Polymer ◽  
Conventional Plate

ABSTRACTParmod™ is a family of materials that can be printed and thermally cured to create metallic conductors on printed wiring boards. This additive process provides a way to produce circuitry direct from CAD files without the necessity for intermediate tooling of any kind. The printed images are converted to pure metallic traces in seconds at a temperature low enough to be compatible with commonly used rigid and flexible polymer-based substrates. This simple, two-step process eliminates the hazardous wastes and employee health and safety issues associated with conventional plate-and-etch photolithographic technologyRecently the Parmod™ technology has been extended from metals to oxides to enable printing passive electronic components such as resistors, capacitors and inductors, as well as the metallic interconnects. While thermal curing of the oxides provides useable electronic properties, particularly of resistors and capacitors, the performance of all these novel materials could be improved by laser processing. This paper discusses preliminary results on laser processing of Parmod™ conductors and components in two different systems

Multiobjective Optimal Placement of Convectively and Conductively Cooled Electronic Components on Printed Wiring Boards

1999 ◽  
Vol 122 (2) ◽  
pp. 152-159 ◽  
Author(s):  
Nestor V. Queipo ◽  
Guy F. Gil
Keyword(s):  
Heat Transfer ◽  
Genetic Algorithm ◽  
Optimal Placement ◽  
Printed Wiring Boards ◽  
Multiattribute Utility ◽  
Utility Analysis ◽  
Electronic Components ◽  
Multiattribute Utility Analysis ◽  
Solution Methodology

This paper presents a solution methodology for the optimal placement of convectively and conductively air-cooled electronic components on planar printed wiring boards considering thermal and electrical/cost design objectives. The methodology combines the use of a heat transfer solver for the prediction of the temperature distribution among the electronic components and a genetic algorithm for the adaptive search of optimal or near optimal solutions and a multiobjective optimization strategy (Pareto optimization and multiattribute utility analysis). After proper validation of the elements of the solution methodology (heat transfer solver/genetic algorithm) in isolation, the methodology under consideration is tested using a placement problem (case study) that considers as optimization criteria the minimization of an estimate of the failure rate of the system of components due to thermal overheating (via an Arrhenius relation) and the minimization of the total wiring length given some interconnectivity requirements. Results corresponding to the case study are presented and discussed for both Pareto optimization and multiattribute utility analysis. [S1043-7398(00)00801-X]

scholarly journals Combined Use of 3D and HSI for the Classification of Printed Circuit Board Components

2021 ◽  
Vol 11 (18) ◽  
pp. 8424
Author(s):  
Songuel Polat ◽  
Alain Tremeau ◽  
Frank Boochs
Keyword(s):  
Printed Circuit Board ◽  
Electronic Waste ◽  
Hyperspectral Data ◽  
Circuit Board ◽  
Added Value ◽  
Mutual Support ◽  
Electronic Components ◽  
3D Data ◽  
Combined Use

Successful recycling of electronic waste requires accurate separation of materials such as plastics, PCBs and electronic components on PCBs (capacitors, transistors, etc.). This article therefore proposes a vision approach based on a combination of 3D and HSI data, relying on the mutual support of the datasets to compensate existing weaknesses when using single 3D- and HSI-Sensors. The combined dataset serves as a basis for the extraction of geometric and spectral features. The classification is performed and evaluated based on these extracted features which are exploited through rules. The efficiency of the proposed approach is demonstrated using real electronic waste and leads to convincing results with an overall accuracy (OA) of 98.24%. To illustrate that the addition of 3D data has added value, a comparison is also performed with an SVM classification based only on hyperspectral data.

Electrostatic Printing, a Versatile Manufacturing Process for the Electronics Industries

2000 ◽  
Vol 625 ◽  
Author(s):  
Robert H. Detig
Keyword(s):  
Functional Materials ◽  
Polymeric Films ◽  
Flat Panel Displays ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Printing Plate ◽  
Coated Metal ◽  
High K ◽  
Manufacturing Applications ◽  
High K Dielectric

AbstractFunctional materials configured as liquid toners are printed on a variety of substrates for various manufacturing processes. The materials include metal toners, resistor toners, high k dielectric toners, phosphors and glass. The substrates printed upon include glass, bare and coated metal, polymeric films and even paper. A fixed configuration electrostatic printing plate is used in most manufacturing applications though traditional photo receptor plates can be used if electronic addressability is desired.Applications of electrostatic printing for electronic packaging products (printed wiring boards and flex circuits) and of passive electronic components themselves will be shown. Results with a pure silver toner printed on both glass and paper will be reported. Examples of passive electronic components like resistors, capacitors, and even inductors that have been electrostatically printed with liquid toners will be shown. Possible applications of toners to the manufacture of flat panel displays will be discussed.

Electrostatic Printing, A Versatile Manufacturing Process for the Electronics Industries

2000 ◽  
Vol 624 ◽  
Author(s):  
Robert H. Detig
Keyword(s):  
Functional Materials ◽  
Polymeric Films ◽  
Flat Panel Displays ◽  
Printed Wiring Boards ◽  
Electronic Components ◽  
Printing Plate ◽  
Coated Metal ◽  
High K ◽  
Manufacturing Applications ◽  
High K Dielectric

ABSTRACTFunctional materials configured as liquid toners are printed on a variety of substrates for various manufacturing processes. The materials include metal toners, resistor toners, high k dielectric toners, phosphors and glass. The substrates printed upon include glass, bare and coated metal, polymeric films and even paper. A fixed configuration electrostatic printing plate is used in most manufacturing applications though traditional photo receptor plates can be used if electronic addressability is desired.Applications of electrostatic printing for electronic packaging products (printed wiring boards and flex circuits) and of passive electronic components themselves will be shown. Results with a pure silver toner printed on both glass and paper will be reported. Examples of passive electronic components like resistors, capacitors, and even inductors that have been electrostatically printed with liquid toners will be shown. Possible applications of toners to the manufacture of flat panel displays will be discussed.

Classification of the effects of AI CP on REE

2021 ◽  
Vol 14 (3) ◽  
pp. 22-28
Author(s):  
Aleksandr Kozyukov ◽  
Pavel Chubunov ◽  
Konstantin Zolnikov ◽  
Pavel Kuc'ko ◽  
Tatyana Skvortsova ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Control Systems ◽  
Outer Space ◽  
Thermal Control ◽  
Space Systems ◽  
Electronic Components ◽  
Protection Measures ◽  
Supply Systems ◽  
Special Protection

During the flight, charged particles of outer space act on space systems (orbital stations, spacecraft, interplanetary spacecraft, etc.), which, without the use of special protection measures, can lead to the failure of onboard systems. They are particularly dangerous for systems that use electronic components (semiconductor devices and integrated circuits, optoelectronic devices). These systems in the spacecraft, as a rule, include all control systems, telemetry systems, receiving and transmitting devices, thermal control systems, power supply systems, etc., which in general can be called radio-electronic equipment (REE).

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