Optimal Placement of Electronic Components to Minimize Heat Flux Nonuniformities

2011 ◽  
Vol 48 (4) ◽  
pp. 556-563 ◽  
Author(s):  
Derek W. Hengeveld ◽  
James E. Braun ◽  
Eckhard A. Groll ◽  
Andrew D. Williams
Keyword(s):  
Heat Flux ◽  
Optimal Placement ◽  
Electronic Components

scholarly journals The use of fractional calculus for the optimal placement of electronic components on a linear array

2015 ◽  
Vol 28 (1) ◽  
pp. 77-84
Author(s):  
Mey de ◽  
Mariusz Felczak ◽  
Bogusław Więcek
Keyword(s):  
Integral Equation ◽  
Fractional Calculus ◽  
Forced Convection ◽  
Linear Array ◽  
The Other ◽  
Simple Solution ◽  
Optimal Placement ◽  
Critical Component ◽  
Electronic Components ◽  
One Dimensional

Cooling of heat dissipating components has become an important topic in the last decades. Sometimes a simple solution is possible, such as placing the critical component closer to the fan outlet. On the other hand this component will heat the air which has to cool the other components further away from the fan outlet. If a substrate bearing a one dimensional array of heat dissipating components, is cooled by forced convection only, an integral equation relating temperature and power is obtained. The forced convection will be modelled by a simple analytical wake function. It will be demonstrated that the integral equation can be solved analytically using fractional calculus.

scholarly journals Experimental Study on Thermal Performance of a Bent Copper-Water Heat Pipe

2020 ◽  
Vol 2020 ◽  
pp. 1-10
Author(s):  
Shuangshuang Miao ◽  
Jiajia Sui ◽  
Yulong Zhang ◽  
Feng Yao ◽  
Xiangdong Liu
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Critical Heat Flux ◽  
Working Conditions ◽  
Thermal Performance ◽  
Heat Input ◽  
High Heat ◽  
High Heat Flux ◽  
Electronic Components ◽  
Copper Water

Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components. The copper-water bent heat pipes are particularly suited to the circumstances of confined space or misplaced heat and cold sources for high-heat-flux electronic components. In this paper, the steady and transient thermal performance of a bent copper-water heat pipe is studied based on a performance test system. The effects of cooling temperature, working conditions on the critical heat flux, and equivalent thermal conductivity have been examined and analyzed. Moreover, the influences of heat input and working conditions on the thermal response of a bent heat pipe have also been discussed. The results indicate that the critical heat flux is enhanced due to the increases in cooling temperature and the lengths of the evaporator and condenser. In addition, the critical heat flux is improved by extending the cooling length only when the operating temperature is higher than 50°C. The improvement on the equivalent thermal by increasing the heating length is more evident than that by increasing cooling length. It is also demonstrated by the experiment that the bent copper-water heat pipe can respond quickly to the variation of heat input and possesses superior transient heat transfer performance.

On Natural Convective Heat Transfer in Vertical Channels With a Single Surface Mounted Heat-Flux Module

2003 ◽  
Vol 125 (4) ◽  
pp. 734-739 ◽  
Author(s):  
G. Desrayaud ◽  
A. Fichera
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Characteristics ◽  
Vertical Channel ◽  
Numerical Data ◽  
Two Dimensional ◽  
Electronic Components ◽  
Adiabatic Wall ◽  
Numerical Predictions ◽  
Fluid Flow Characteristics

This paper presents the numerical predictions of heat transfer and fluid flow characteristics for natural convection in a vertical channel with two-dimensional protruding heat-flux module as applied to the cooling of electronic components. The investigation is for a configuration consisting of a single module mounted on a vertical adiabatic wall. An attempt was made to combine the temperature of the module for all the dimensions of the module into a single composite correlation, along with the numerical data.

Effect of the Inclination on Three-Dimensional Incompressible Fluid Flow in a Discretely Heated Cavity

2013 ◽  
Vol 597 ◽  
pp. 3-8
Author(s):  
Lahoucine Belarche ◽  
Btissam Abourida ◽  
Slawomir Smolen ◽  
Touria Mediouni
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Fluid Flow ◽  
Vertical Wall ◽  
Three Dimensional ◽  
The Other ◽  
Uniform Temperature ◽  
Incompressible Fluid Flow ◽  
Electronic Components ◽  
Flow And Heat Transfer

Natural convection in inclined cubic cavity, discretely heated, is studied numerically using a three-dimensional finite volume formulation. Two heating square portions are placed on the vertical wall of the enclosure, while the rest of the considered wall is adiabatic. These sections, similar to the integrated electronic components, generate a heat flux q". The opposite vertical wall is maintained at a cold uniform temperature Tc and the other walls are adiabatic. The fluid flow and heat transfer in the cavity are studied for different sets of the governing parameters, namely the Rayleigh number Ra (103 ≤ Ra ≤ 107), the cavity inclination γ (- 45° ≤ γ ≤ 45°) and the position of the heating sections λ (0.3 ≤ λ ≤ 0.7). The dimensions of the heater sections, ε = D / H and the longitudinal aspect ratio of the cavity Ax = H / L are respectively fixed to 0.35 and 1.

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

2004 ◽  
Vol 126 (3) ◽  
pp. 317-324 ◽  
Author(s):  
Hiroshi Honda ◽  
ZhengGuo Zhang ◽  
Nobuo Takata
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Test Section ◽  
Cooling System ◽  
Natural Circulation ◽  
Electronic Components ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Test Loop

Experiments were conducted to study the flow and heat transfer characteristics of a natural circulation liquid cooling system for electronic components. The test loop consisted of a horizontal test section, a horizontal evaporator, a vertical tube, a horizontal condenser, a rubber bag attached at the exit of the condenser, a downcomer, a mass flow meter, and a liquid subcooler. The loop height H was set at either 250 or 450 mm. FC-72 was filled in the test loop up to some level of loop height and the upper part was filled with air. During the operation of the cooling system, the rubber bag expanded and stored the mixture of generated vapor and air. Thus the inner pressure was maintained at atmospheric pressure. In the test section, a silicon chip with dimensions of 10×10×0.5 mm3 was attached at the bottom surface of a horizontal duct with dimensions of 10×14 mm2. A smooth chip and four chips with square micro-pin-fins with 150 to 300 μm in fin height were tested. The duct height s was set at 10 mm for most of the experiments. The cases of s=1 and 25 mm were also tested for one of the micro-pin-finned chips. For each H, the average flow rate of FC-72 was correlated well as a function of the static pressure difference between the two vertical tubes. All chips showed the boiling curve similar to that for pool boiling except that the critical heat flux was lower for the natural circulation loop. For all chips tested, the maximum allowable heat flux qmax increased monotonically with increasing liquid subcooling ΔTsub. Comparison of the results for s=1, 10 and 25 mm revealed that the highest qmax was obtained with s=10 mm. The values of qmax for s=1 and 25 mm were 36–46% and 87–90% of that for s=10 mm, respectively. The maximum value of qmax=56 W/cm2 was obtained by one of the micro-pin-finned chips at s=10 mm and ΔTsub=35 K.

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

2005 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid Hadim
Keyword(s):  
Neural Networks ◽  
Heat Flux ◽  
Artificial Neural Networks ◽  
Forced Convection ◽  
Channel Flow ◽  
Superposition Method ◽  
Electronic Components ◽  
Printed Circuit ◽  
Placement Optimization ◽  
Optimization Methodology

A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) in channel flow forced convection is presented. In this methodology, thermal, electrical, and placement criteria involving junction temperature, wiring density, line length for high frequency signals, and critical component location are optimized simultaneously using the genetic algorithm. A board-level thermal performance prediction methodology based on channel flow forced convection boundary conditions is developed. The methodology consists of a combination of artificial neural networks (ANNs) and a superposition method that is able to predict PCB surface and component junction temperatures in a much shorter calculation time than the existing numerical methods. Three ANNs are used for predicting temperature rise at the PCB surface caused by a single heat flux at an arbitrary location on the board, while temperature rise due to multiple heat flux is calculated using a superposition method. Compact thermal models are used for the electronic components thermal modeling. Using this optimization methodology, large calculation time reduction is achieved without losing accuracy. For thermal model validation, the present thermal methodology predicts junction temperatures with maximum error of 1.8°C comparing to the conjugate solid/ fluid heat transfer analysis result. The present thermal modeling takes 12 seconds, while the conjugate analysis takes 30 hours for the validation on the same computer. To demonstrate the capabilities of the present methodology, a test case of component placement on a PCB is presented.

Numerical Investigations of the Effect of Flow Arrangement and Number of Layers on the Performance of Multi-Layer Microchannel Heat Sinks

2015 ◽  
Author(s):  
M. B. Effat ◽  
M. S. AbdelKarim ◽  
O. Hassan ◽  
M. Abdelgawad
Keyword(s):  
Heat Flux ◽  
Temperature Distribution ◽  
Heat Sink ◽  
Single Layer ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Microchannel Heat Sink ◽  
Electronic Components ◽  
Number Of Layers ◽  
Microchannel Heat Sinks

With the advance of miniaturization technology, more and more electronic components are placed onto small electronic chips. This leads to the generation of high amounts of thermal energy that should be removed for the safe operation of these electronic components. Microchannel heat sinks, where electronic chips are liquid cooled instead of the conventional air cooling techniques, were proposed as a means to improve cooling rates. Later on, double layer micro channel heat sinks were suggested as an upgrade to single layer microchannel heat sinks with a better thermal performance. In the present study the effects of increasing the number of layers of the microchannel heat sink to three-layers as well as the effect of changing the flow arrangements (counter and parallel flows) within the three channel layers on the thermal performance of the heat sink were investigated. In all investigated cases the temperature distribution over the base of the microchannel heat sink system and the total pressure drop are reported. A range of mass flow rates from 1×10−4 to 5×10−4 kg/s was considered. Uniform heat flux conditions were considered during the study. COMSOL Multiphysics finite element package was employed for the numerical analysis. Results indicate significant enhancement in the uniformity of the temperature on the processor surface when multi-layer channels were employed, compared to the single-layer case. The uniformity in the temperature distribution was accompanied by reduction of pressure drop across channels for the same mass flow rate and heat flux conditions. The counter flow arrangement showed the best temperature distribution with the uniform heat flux cases.

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