Issues in validating package compact thermal models for natural convection cooled electronic systems

1997 ◽  
Vol 20 (4) ◽  
pp. 420-431 ◽  
Author(s):  
V.H. Adams ◽  
D.L. Blackburn ◽  
Y.K. Joshi ◽  
D.W. Berning
Keyword(s):  
Natural Convection ◽  
Electronic Systems ◽  
Thermal Models

Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses

2011 ◽  
Vol 51 (8) ◽  
pp. 1351-1355 ◽  
Author(s):  
Marcin Janicki ◽  
Jedrzej Banaszczyk ◽  
Bjorn Vermeersch ◽  
Gilbert De Mey ◽  
Andrzej Napieralski
Keyword(s):  
Time Constant ◽  
Transient Temperature ◽  
Electronic Systems ◽  
Thermal Models ◽  
Temperature Responses ◽  
Reduced Dynamic

Compact Thermal Models: A Global Approach

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Mohamed-Nabil Sabry ◽  
Hossam Saleh Abdelmeguid
Keyword(s):  
Degrees Of Freedom ◽  
Quantitative Description ◽  
Operating Conditions ◽  
Electronic Systems ◽  
New Approach ◽  
Thermal Models ◽  
Cooling Devices ◽  
Precision Level ◽  
Access To Data ◽  
Level Of Analysis

The construction and usage of compact thermal models (CTMs), for the thermal analysis as well as the design of cooling devices for electronic systems, are reviewed. These models have many advantages over the so called detailed models based on 3D simulations, mainly being a convenient and simple quantitative description of the modeled object, when constructional details are either unavailable or too detailed to be of use at the desired level of analysis. However, CTMs have manifested some deficiencies in many cases, in particular, multiple chip modules (MCM) and stacked dies. The opposite approach, detailed modeling, is more reliable, although extremely heavy. A new approach is proposed that solves this dilemma by bridging the gap between compact and detailed models. While retaining all advantages of CTMs, i.e., having a limited number of degrees of freedom and not requiring detailed constructional features, it can attain any required precision level depending on the degree of complexity adopted. It gives reliable results covering all operating conditions including MCM and stacked dies. Moreover, it gives access to data on surface temperature gradients that were never obtained before by compact models and are highly important for reliability issues.

Analysis of nonlinear heat exchange phenomena in natural convection cooled electronic systems

2016 ◽  
Vol 67 ◽  
pp. 15-20 ◽  
Author(s):  
Gilbert De Mey ◽  
Tomasz Torzewicz ◽  
Piotr Kawka ◽  
Andrzej Czerwoniec ◽  
Marcin Janicki ◽  
...  
Keyword(s):  
Natural Convection ◽  
Heat Exchange ◽  
Electronic Systems

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

2003 ◽  
Author(s):  
Mohamed-Nabil Sabry
Keyword(s):  
Thermal Effects ◽  
Recent Progress ◽  
Systems Design ◽  
Electronic Systems ◽  
Problem Complexity ◽  
Thermal Models ◽  
Dynamic Case ◽  
Physical Effects ◽  
Compact Models ◽  
And Performance

Both reliability and performance of electronic systems can be seriously affected by dynamic thermal and electro-thermal effects that take place at the device, chip, package, board and system levels. The marked trend towards miniaturization down to the nano-scale, increases problem complexity due to the large number of devices and multiplicity of physical effects involved. It accentuates also the importance of thermal effects. To deal with such complicated systems, design and analysis heavily rely on compact models. Recent advances have been made to extend the relatively more mature knowledge of static compact thermal models to the dynamic case. Although the theory of dynamic compact models is far from being complete, the wealth of methods proposed has deserved a review highlighting advances made and proposing new axis of research, which is the purpose of this paper.

A Suggestion on Heat Sink Simplification on Natural Convection

2003 ◽  
Author(s):  
Won Nyun Kim ◽  
Choong Ki Kim
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Heat Sink ◽  
Flow Resistance ◽  
Computation Time ◽  
Point Of View ◽  
Working Fluid ◽  
Electronic Systems ◽  
Modified Model ◽  
Thermal Fields

Heat sink is commonly found in electronic systems. For its optimization, numerical computation is introduced. However, narrow gaps between the fins of heat sink have been a troubling factor. That increases the number of grid excessively, and results in increased computation time. The quality of grid can be poor and that halt the accuracy of computed numerical solution. To avoid these problems, many simplification methods are proposed by simplifying complex heat sink. The most popular example is regarding the array of fins as flow resistance from hydraulic point of view and working fluid with different thermal conductivity for thermal equivalence [1]. Its thermal conductivity can be determined according to well-known relationship between Nu, Re, and Pr (see [2, 3]). This simplification presents many advantages but it is not applicable to natural convection. In this paper, a modified model is suggested to extend the simplification to natural convection, which is still popularly applied to electro cooling systems. With the results of [4], thermal conductivity of flow resistance region is iteratively. The modified model is verified by computing flow and thermal fields of PDP. Applying this model to fanless PDP, the number of total grid is reduced by 38.5% percents and corresponding computation time was saved while the accuracy of computed solution is kept undamaged.

Experimental Study on Natural Convection From Vertical Cylinders With Branched Fins

2013 ◽  
Author(s):  
Kuen Tae Park ◽  
Byeongdong Kang ◽  
Hyun Jung Kim ◽  
Dong-Kwon Kim
Keyword(s):  
Natural Convection ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Electronic Components ◽  
Cooling Systems ◽  
Cooling Technology ◽  
Vertical Cylinders

Advances in semiconductor technology and trends in slim and light electronic systems have led to a significant increase in heat dissipation density of the electronic devices. Therefore, effective cooling technology is essential for reliable operation of electronic components. Among various cooling systems, natural convection heat sinks have been proven to be appropriate because of their inherent simplicity, reliability, and low long-term cost. The present study is focused on natural convective heat transfer from the cylindrical heat sink. Especially, the branched fins, which are motivated by the branched design of nature shown in trees and lungs, are used. The heating power and surface temperature are measured for various types of branched fins and numbers of fins. The result showed that the branched fin dissipates 20% more heat compared to the normal plate fins. Therefore, heat sinks with branched fins have a potential as a next-generation cooling device.

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