A Suggestion on Heat Sink Simplification on Natural Convection

2003 ◽  
Author(s):  
Won Nyun Kim ◽  
Choong Ki Kim
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Heat Sink ◽  
Flow Resistance ◽  
Computation Time ◽  
Point Of View ◽  
Working Fluid ◽  
Electronic Systems ◽  
Modified Model ◽  
Thermal Fields

Heat sink is commonly found in electronic systems. For its optimization, numerical computation is introduced. However, narrow gaps between the fins of heat sink have been a troubling factor. That increases the number of grid excessively, and results in increased computation time. The quality of grid can be poor and that halt the accuracy of computed numerical solution. To avoid these problems, many simplification methods are proposed by simplifying complex heat sink. The most popular example is regarding the array of fins as flow resistance from hydraulic point of view and working fluid with different thermal conductivity for thermal equivalence [1]. Its thermal conductivity can be determined according to well-known relationship between Nu, Re, and Pr (see [2, 3]). This simplification presents many advantages but it is not applicable to natural convection. In this paper, a modified model is suggested to extend the simplification to natural convection, which is still popularly applied to electro cooling systems. With the results of [4], thermal conductivity of flow resistance region is iteratively. The modified model is verified by computing flow and thermal fields of PDP. Applying this model to fanless PDP, the number of total grid is reduced by 38.5% percents and corresponding computation time was saved while the accuracy of computed solution is kept undamaged.

Advanced Passive Thermal Management for LED Bulb Systems

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001277-001293
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Point Of View ◽  
Hazardous Substances ◽  
Size And Shape ◽  
Lighting Systems ◽  
Liquid Cooling System ◽  
Forced Cooling

The movement to LED lighting systems worldwide is accelerating quickly as energy savings and reduction of hazardous substances (RoHS) increase in importance. Furthering this trend are government regulations, rebate programs and declining prices. The market drive today is to replace light bulbs of common outputs (60W, 75W and 100W) without resorting to Compact Fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19 for fixture retrofitting. This A19 size and shape restriction causes a small heat sink which is only capable of dissipating heat for 60W equivalent LED bulbs with natural convection. 75W and 100W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today's current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7 °C/W. A more efficient method of cooling can be created using a chimney-based design to lower system thermal resistances below 4 °C/W while meeting all other requirements for bulb system design. Numerical studies and test data are in good agreement for various orientations including methods for keeping the chimney partially active in horizontal orientations. Such chimney-based designs are capable of cooling 75W and 100W equivalent LED light bulbs in the limited volume constraints of A19-size devices.

Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks

1999 ◽  
Vol 123 (3) ◽  
pp. 315-318 ◽  
Author(s):  
Keiji Sasao ◽  
Mitsuru Honma ◽  
Atsuo Nishihara ◽  
Takayuki Atarashi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Numerical Analysis ◽  
Numerical Method ◽  
Heat Sink ◽  
Flow Resistance ◽  
Air Flow ◽  
Heat Sinks ◽  
Flow And Heat Transfer ◽  
Conventional Methods

A numerical method for simulating impinging air flow and heat transfer in plate-fin type heat sinks has been developed. In this method, all the fins of an individual heat sink and the air between them are replaced with a single, uniform element having an appropriate flow resistance and thermal conductivity. With this element, fine calculation meshes adapted to the shape of the actual heat sink are not needed, so the size of the calculation mesh is much smaller than that of conventional methods.

scholarly journals Investigation of heat transfer enhancement in an annular conduit with angled fins using functionalized GNP colloidal suspension

2021 ◽  
Vol 945 (1) ◽  
pp. 012058
Author(s):  
Sayshar Ram Nair ◽  
Cheen Sean Oon ◽  
Ming Kwang Tan ◽  
S.N. Kazi
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Heat Exchangers ◽  
Power Plants ◽  
Colloidal Suspension ◽  
Industrial Applications ◽  
Point Of View ◽  
Solid Particles ◽  
Working Fluid

Abstract Heat exchangers are important equipment with various industrial applications such as power plants, HVAC industry and chemical industries. Various fluids that are used as working fluid in the heat exchangers such as water, oil, and ethylene glycol. Researchers have conducted various studies and investigations to improve the heat exchanger be it from material or heat transfer point of view. There have been attempts to create mixtures with solid particles suspended. This invention had some drawbacks since the pressure drop was compromised, on top of the occurrence of sedimentation or even erosion, which incurs higher maintenance costs. A new class of colloidal suspension fluid that met the demands and characteristics of a heat exchanger was then created. This novel colloidal suspension mixture was then and now addressed as “nanofluid”. In this study, the usage of functionalized graphene nanoplatelet (GNP) nanofluids will be studied for its thermal conductivity within an annular conduit with angled fins, which encourage swirling flows. The simulation results for the chosen GNP nanofluid concentrations have shown an enhancement in thermal conductivity and heat transfer coefficient compared to the corresponding base fluid thermal properties. The data from this research is useful in industrial applications which involve heat exchangers with finned tubes.

Compact Thermal Representations for Several Fundamental Shapes in Natural Convection

2003 ◽  
Author(s):  
Kyle A. Brucker ◽  
Kyle T. Ressler ◽  
Joseph Majdalani
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Heat Sink ◽  
Volume Of Fluid ◽  
Compact Representation ◽  
Canonical Forms ◽  
Design Engineers ◽  
Porous Block

In this article, general canonical forms for the effective thermal conductivities of compact heat sink models are derived using perturbation tools. The resulting approximations apply to a large number of fundamental heat sink shapes used in natural convection applications. The effective thermal conductivity is a property that can be assigned to the porous block (i.e., volume of fluid) above the heat sink base that was once occupied by the fins. The increased thermal conductivity of the fluid entering the porous block produces a reduced thermal resistance that matches that of the original heat sink. The use of a compact representation is accompanied by substantial computational savings that promote faster optimization and communication between simulation analysts and design engineers. The generalized approximations for the effective thermal conductivity presented here are numerically verified.

Advanced Natural Convection Cooling Designs for LED Bulb Systems

2013 ◽  
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Point Of View ◽  
Light Bulb ◽  
Size And Shape ◽  
Lighting Systems ◽  
Liquid Cooling System ◽  
Forced Cooling

The movement to LED lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today’s strong drive is to replace light bulbs of common outputs (60W, 75W and 100W) without resorting to Compact Fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat for 60W equivalent LED bulbs with natural convection for today’s LED efficacies. 75W and 100W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today’s current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7°C/W. This paper presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4°C/W for various orientations including methods for keeping the chimney partially active in horizontal orientations. Significant parameters are also studied with effects upon performance. The simulations are in good agreement with the experimental data. Such chimney-based designs are shown to enable 75W and 100W equivalent LED light bulb designs critical for faster penetration of LED systems into general lighting applications.

Metallic Nanoemulsion for Microchannel Heat-Sink

2016 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Gordon Yip ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Specific Heat ◽  
Heat Sink ◽  
Effective Medium Theory ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Viscosity Change ◽  
Transfer Capability ◽  
Heat Transfer Capability

Galinstan is a eutectic alloy of gallium, indium, and tin, of which thermal conductivity is ∼27 times higher than that of water, while the dynamic viscosity is only twice. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the direct use of galinstan can suffer from practical issues such as oxidation and low specific heat. Therefore, galinstan is mixed with a coolant as an additive to form a colloidal fluid; i.e., dispersion of nanoscale galinstan droplets in a coolant to enhance the thermal conductivity. It is expected that this “metallic nanoemulsion” can contribute to substantial improvement in heat transfer capability. Also, the common issues with colloidal fluids such as rapid sedimentation, erosion, and clogging, can be minimized by the “fluidity” of the liquid metal. It was shown that ultrasonic emulsification can yield few hundreds scale nanodroplets. However, the long exposure of galinstan to oxygen in water inevitably results in severe oxidation of the droplets. Theoretical analysis was also conducted to examine the feasibility of the metallic nanoemulsion as a microchannel heat-sink working fluid. Effective medium theory was used to evaluate the thermal conductivity of the mixture. The viscosity change was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Under one-dimensional laminar flow assumption, mass, momentum, and energy conservation equations were analytically solved. The effect of high thermal conductivity of galinstan was evident; the convection heat transfer capability was greatly enhanced, while the viscosity increase due to the nanoscale blending and the low specific heat of galinstan counteracts and reduce the flow rate and thus increase the caloric thermal resistance.

scholarly journals Effect of the Presence of a Heat Conducting Horizontal Square Block on Mixed Convection inside a Vented Square Cavity

2009 ◽  
Vol 14 (4) ◽  
pp. 531-548 ◽  
Author(s):  
Md. M. Rahman ◽  
M. A. Alim ◽  
S. Saha ◽  
M. K. Chowdhury
Keyword(s):  
Thermal Conductivity ◽  
Nusselt Number ◽  
Mixed Convection ◽  
Average Nusselt Number ◽  
Working Fluid ◽  
Heat Conducting ◽  
Fluid Temperature ◽  
Square Cavity ◽  
Thermal Fields ◽  
Solid Block

Finite element method is used to solve two-dimensional governing mass, momentum and energy equations for steady state, mixed convection problem inside a vented square cavity. The cavity consists of adiabatic left, top and bottom walls and heated right vertical wall; but it also contains a heat conducting horizontal square block located somewhere inside the cavity. Forced flow conditions are imposed by providing an inlet at the bottom of the left wall and an exit at the top of the right wall, through which the working fluid escape out of the cavity. The aim of the study is to describe the effect of such block on the flow and thermal fields. The investigations are conducted for various values of geometric size, location and thermal conductivity of the block under constant Reynolds and Prandtl numbers. Various results such as the streamlines, isotherms, heat transfer rates in terms of the average Nusselt number, average fluid temperature in the cavity and the temperature at the center of solid block are presented for different parameters. It is observed that the block size and location have significant effect on both the flow and thermal fields but the solid-fluid thermal conductivity ratio has insignificant effect on the flow field. The results also indicate that the average Nusselt number at the heated surface, the average temperature of the fluid inside the cavity and the temperature at the center of solid block are strongly dependent on the configurations of the system studied under different geometrical and physical conditions.

A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling

2019 ◽  
Author(s):  
Ahmed Elkholy ◽  
Roger Kempers
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Heat Sinks ◽  
Working Fluid ◽  
Convection Heat ◽  
Two Phase ◽  
Spreading Resistance

Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent shortcomings due to heat spreading resistance of the heat sink baseplate particularly in natural convection heat sinks used to cool small localized heat sources. Heat pipes embedded within the base of heat sinks can be used to improve spreading performance but are limited by the ability to conduct heat into and out of the heat pipes. In the current study, a small, naturally aspirated two-phase thermosyphon heat sink was developed and characterized experimentally. The proposed architecture integrates all thermosyphon components into one compact device, where the evaporator, riser and the downcomer are incorporated at the heat sink base. The downcomer also serves as the condenser within the base of a vertical finned natural convection heat sink. The side-heated evaporator consists of an array mini-channels configuration which can operate in either pool boiling or flow boiling configuration, which allows the thermosyphon heat sink to operate in either reflux mode or looped mode, respectively. Experiments were carried out using HFE 7000 as the working fluid. The effect of the of input power on the thermal performance is examined for both modes for powers ranging from 10 to 80 W. Results demonstrate that this approach significantly reduces the spreading resistance resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink.

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
James Petroski
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Energy Savings ◽  
Cooling System ◽  
Light Emitting Diode ◽  
Point Of View ◽  
Light Bulb ◽  
Light Emitting ◽  
Size And Shape ◽  
Liquid Cooling System

The movement to light-emitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today's strong drive is to replace light bulbs of common outputs (60 W, 75 W, and 100 W) without resorting to compact fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches are desirable for light bulbs from a consumer point of view. Thus, there is interest in developing natural convection cooled A19 light bulb designs for LEDs that cool far more effectively than today's current designs. Current A19 size heat sink designs typically have thermal resistances of 5–7 °C/W. This paper presents designs utilizing the effects of chimney cooling, well developed for other fields that reduce heat sink resistances by significant amounts while meeting all other requirements for bulb system design. Numerical studies and test data show performance of 3–4 °C/W for various orientations including methods for keeping the chimney partially active in horizontal orientations. Significant parameters are also studied with effects upon performance. The simulations are in good agreement with the experimental data. Such chimney-based designs are shown to enable 75 W and 100 W equivalent LED light bulb designs critical for faster penetration of LED systems into general lighting applications.

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

2015 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Specific Heat ◽  
Thermal Management ◽  
Heat Sink ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Pumping Power

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.

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