Coherent receiver front-end module including a polarization diversity waveguide OIC and a high-speed InGaAs twin-dual p-i-n photodiode OEIC both based on InP

1992 ◽  
Vol 4 (11) ◽  
pp. 1234-1237 ◽  
Author(s):  
M. Hamacher ◽  
H. Heidrich ◽  
U. Kruger ◽  
R. Stenzel ◽  
J.G. Bauer ◽  
...  
2008 ◽  
Vol 1075 ◽  
Author(s):  
NamKee Kang ◽  
Junchul Kim ◽  
Dongsu Kim ◽  
ChanSei Yoo ◽  
JongIn Ryu ◽  
...  

ABSTRACTThe convergence paradigm of today, which can be characterized as multi function and high effectiveness, strongly requires an integration of RF/analog function and high-speed digital function into a single IC or package. System on Package (SOP) is a promising technology for system integration in order to meet these current trends and requirements. A passive embedded substrate is one of the most critical issues to achieve small-size and high-functional devices and modules with high integration density and deign flexibility for wireless communications.This paper will describe integration approach for passive embedded substrate for RF applications. With the several examples such as multi-band front end module and passive/active integrated modules, the advantages of the integration using passive embedded substrates will be described with some design considerations.


2014 ◽  
Vol 2014 ◽  
pp. 1-20
Author(s):  
Bodhisatwa Sadhu ◽  
Martin Sturm ◽  
Brian M. Sadler ◽  
Ramesh Harjani

This paper explores passive switched capacitor based RF receiver front ends for spectrum sensing. Wideband spectrum sensors remain the most challenging block in the software defined radio hardware design. The use of passive switched capacitors provides a very low power signal conditioning front end that enables parallel digitization and software control and cognitive capabilities in the digital domain. In this paper, existing architectures are reviewed followed by a discussion of high speed passive switched capacitor designs. A passive analog FFT front end design is presented as an example analog conditioning circuit. Design methodology, modeling, and optimization techniques are outlined. Measurements are presented demonstrating a 5 GHz broadband front end that consumes only 4 mW power.


Author(s):  
Chun-Wen Paul Huang ◽  
William Vaillancourt ◽  
Christophe Masse ◽  
Joe Soricelli ◽  
Tony Quaglietta ◽  
...  
Keyword(s):  

2021 ◽  

Contents Structural components/Strukturbauteile Development of an energy-absorbing structural element made of polyamide integrated in the plastic front-end carrier of the new Mercedes S-Class ..... 1 Entwicklung eines energieabsorbierenden Strukturelements aus Polyamid integriert im Kunststoff-Frontendträger der neuen Mercedes S-Klasse ..... 5 BAGS: Highly-integrated front-end module carrier ..... 9 BAGS: Hochintegrierter Front End Modulträger ..... 19 Surfaces/Oberflächen Lightweight plastic construction with visible surface as examplified by the Volkswagen ID 3 tailgate ..... 29 Kunststoffleichtbau mit Sichtoberfläche am Beispiel der Heckklappe Volkswagen ID3 ..... 39 Breakthrough in producing soft and sustainable interior surfaces by injection moulding of TPE ..... 49 Simulation The all-new MAN high-roof cab – epoxy sandwich RTM – simulated using FEM and crashed under real conditions ..... 61 Epoxid-Sandwich-RTM – FEM gerechnet und real gecrasht ..... 75 Development and validation of a simulation methodology for the prediction of surface defects for plastic components with metallic effect pig...


2011 ◽  
Vol 29 (4) ◽  
pp. 378-385 ◽  
Author(s):  
J K Fischer ◽  
R Ludwig ◽  
L Molle ◽  
C Schmidt-Langhorst ◽  
C C Leonhardt ◽  
...  

2018 ◽  
Vol 26 (24) ◽  
pp. 31222 ◽  
Author(s):  
Md. G. Saber ◽  
M. Osman ◽  
D. Patel ◽  
A. Samani ◽  
E. El-Fiky ◽  
...  
Keyword(s):  

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