A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits

1994 ◽  
Vol 7 (4) ◽  
pp. 413-422 ◽  
Author(s):  
A. Khotanzad ◽  
H. Banerjee ◽  
M.D. Srinath
Keyword(s):  
Integrated Circuits ◽  
Vision System ◽  
Bonding Wires ◽  
Ball Bonds

scholarly journals Architecture and implementation of a high frame-rate stereo vision system

2021 ◽  
Author(s):  
Jamin Islam
Keyword(s):  
Integrated Circuits ◽  
Stereo Vision ◽  
High Speed ◽  
Vision System ◽  
Low Cost ◽  
Cost Effective ◽  
Frame Rate ◽  
Superior Performance ◽  
High Frame Rate ◽  
Stereo Vision System

For the purpose of autonomous satellite grasping, a high-speed, low-cost stereo vision system is required with high accuracy. This type of system must be able to detect an object and estimate its range. Hardware solutions are often chosen over software solutions, which tend to be too slow for high frame-rate applications. Designs utilizing field programmable gate arrays (FPGAs) provide flexibility and are cost effective versus solutions that provide similar performance (i.e., Application Specific Integrated Circuits). This thesis presents the architecture and implementation of a high frame-rate stereo vision system based on an FPGA platform. The system acquires stereo images, performs stereo rectification and generates disparity estimates at frame-rates close to 100 fpSi and on a large-enough FPGA, it can process 200 fps. The implementation presents novelties in performance and in the choice of the algorithm implemented. It achieves superior performance to existing systems that estimate scene depth. Furthermore, it demonstrates equivalent accuracy to software implementations of the dynamic programming maximum likelihood stereo correspondence algorithm.

scholarly journals A Simulation Methodology for Wirebonds Interconnects of Radiofrequency Integrated Circuits

2015 ◽  
Vol 10 (3) ◽  
pp. 181-186
Author(s):  
Hercílio M. Cavalcanti ◽  
Leandro Manera
Keyword(s):  
Integrated Circuits ◽  
Power Amplifier ◽  
Test Bench ◽  
Simulation Methodology ◽  
Parameters Extraction ◽  
S Parameters ◽  
Bonding Wires ◽  
Rf Ic

This work presents a methodology for the simulation of bonding wires under the circumstance when signals with RF frequencies are employed and thus, the impedances of the parasitic resistances, capacitances and inductances of these interconnections are no longer negligible. A s-parameters extraction strategy for each of the wirebonds will be shown with the help of Agilent’s EM simulator ADS resulting in a netlist in spectre which will be used in the test-bench of the designed IC to emulate the behavior of the bondwires and thus making possible a proper dimensioning and tuning of the RF chip to ensure a better performance of the encapsulated RF IC. Finally the design example of a power amplifier is proposed and some aspects of the interaction of this block with the wirebonds are studied.

Improvement of High-Temperature Reliability of Ball Bond Using Platinum-Modified Gold Alloy Wires

2007 ◽  
Vol 4 (2) ◽  
pp. 45-50 ◽  
Author(s):  
Kazunari Maki ◽  
Yuji Nakata ◽  
Masayoshi Nagao ◽  
Akifumi Mishima
Keyword(s):  
High Temperature ◽  
Thermal Aging ◽  
Gold Alloy ◽  
Microstructural Analysis ◽  
Ball Bond ◽  
Ball Shear ◽  
Aging Test ◽  
Bond Degradation ◽  
Bonding Wires ◽  
Ball Bonds

For superior Au/Al ball-bond reliability, we have developed the 3N (>99.9 wt% Au), 2N5 (>99.5 wt% Au) and 2N (>99 wt% Au) Au alloy bonding wires which contain less than 0.1, 0.5 and 1 wt% Pt, respectively. In the thermal aging test of squashed balls (40 μm in diameter), which consists of storage in air at 250°C and evaluation with wire pull and ball shear, it has been found that there are interesting differences in the ball-bond degradation as a function of wire type. Even the samples bonded using the 3N wire with a very small amount of Pt show superior ball-bond reliability compared with those using a 4N (>99.99 wt% Au) wire without any addition of Pt. The ball-bond degradation in the thermal aging test is reduced significantly with increasing Pt content of a wire. From microstructural analysis of the aged 2N ball bonds, the Pt-containing layer, which seems to play a crucial role in improvement of the ball-bond reliability, have been found in the upper part of intermetallic compounds.

The Use of X-ray Topography to Map Mechanical, Thermomechanical and Wire-Bond Strain Fields in Packaged Integrated Circuits

1997 ◽  
Vol 505 ◽  
Author(s):  
Patrick J. McNally ◽  
R. Rantamäki ◽  
John W. Curley ◽  
T. Tuomi ◽  
A. N. Danilewsky ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Thermal Processing ◽  
Strain Fields ◽  
X Ray ◽  
Wire Bond ◽  
Bond Strain ◽  
Bonding Wires ◽  
Processing Steps

ABSTRACTThermal processing steps in the production of packaged integrated circuits can lead to thermomechanical stresses. Additionally, the process of bonding wires to contact pads can lead to strain fields attributable to these. Synchrotron x-ray topography has been applied to packaged EEPROM Si ICs in order to produce maps of the strain fields induced by such processing steps. This technique allows for depth-resolved mapping with resolutions currently in the region of 5–10 μm throughout the entire mapping volume.

scholarly journals Architecture and implementation of a high frame-rate stereo vision system

2021 ◽  
Author(s):  
Jamin Islam
Keyword(s):  
Integrated Circuits ◽  
Stereo Vision ◽  
High Speed ◽  
Vision System ◽  
Low Cost ◽  
Cost Effective ◽  
Frame Rate ◽  
Superior Performance ◽  
High Frame Rate ◽  
Stereo Vision System

For the purpose of autonomous satellite grasping, a high-speed, low-cost stereo vision system is required with high accuracy. This type of system must be able to detect an object and estimate its range. Hardware solutions are often chosen over software solutions, which tend to be too slow for high frame-rate applications. Designs utilizing field programmable gate arrays (FPGAs) provide flexibility and are cost effective versus solutions that provide similar performance (i.e., Application Specific Integrated Circuits). This thesis presents the architecture and implementation of a high frame-rate stereo vision system based on an FPGA platform. The system acquires stereo images, performs stereo rectification and generates disparity estimates at frame-rates close to 100 fpSi and on a large-enough FPGA, it can process 200 fps. The implementation presents novelties in performance and in the choice of the algorithm implemented. It achieves superior performance to existing systems that estimate scene depth. Furthermore, it demonstrates equivalent accuracy to software implementations of the dynamic programming maximum likelihood stereo correspondence algorithm.

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