Electromigration characteristics of TiN barrier layer material

1995 ◽  
Vol 16 (6) ◽  
pp. 230-232 ◽  
Author(s):  
Jiang Tao ◽  
N.W. Cheung ◽  
Chenming Hu
Keyword(s):  
Barrier Layer ◽  
Layer Material

Evaluation of Praseodymium and Gadolinium Doped Ceria as a Possible Barrier Layer Material for Solid Oxide Cells

2019 ◽  
Vol 91 (1) ◽  
pp. 1165-1172 ◽  
Author(s):  
Bartosz Jerzy Kamecki ◽  
Jakub Karczewski ◽  
Piotr Jasinski ◽  
Sebastian Molin
Keyword(s):  
Barrier Layer ◽  
Solid Oxide ◽  
Doped Ceria ◽  
Layer Material ◽  
Gadolinium Doped Ceria

AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules

2019 ◽  
Vol 48 (10) ◽  
pp. 6815-6822 ◽  
Author(s):  
Jiaxu Zhu ◽  
Fusheng Liu ◽  
Bo Gong ◽  
Xiao Wang ◽  
Weiqin Ao ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Thermoelectric Modules ◽  
Layer Material

W18O49nanowire composites as novel barrier layers for Li–S batteries based on high loading of commercial micro-sized sulfur

RSC Advances ◽  
2016 ◽  
Vol 6 (18) ◽  
pp. 15234-15239 ◽  
Author(s):  
Weikun Zhang ◽  
Chong Lin ◽  
Shan Cong ◽  
Junyu Hou ◽  
Bin Liu ◽  
...  
Keyword(s):  
Barrier Layer ◽  
Specific Capacity ◽  
High Loading ◽  
Shuttle Effect ◽  
Barrier Layers ◽  
Layer Material

A novel barrier layer material, nonstoichiometric W18O49nanowire is reported to alleviate the undesirable shuttle effect, thereby largely boosting the specific capacity and cyclability of Li–S batteries.

Deposited emulsion particles in the pores of aluminum oxide film

1978 ◽  
Vol 36 (1) ◽  
pp. 450-451
Author(s):  
Michio Ashida ◽  
Yasukiyo Ueda
Keyword(s):  
Oxide Film ◽  
Acid Solution ◽  
Barrier Layer ◽  
Colloidal Particles ◽  
Oxalic Acid Solution ◽  
Anodic Oxide ◽  
Anodic Oxide Film ◽  
Carbon Replica ◽  
Sectioning Method ◽  
Thin Sectioning

An anodic oxide film is formed on aluminum in an acidic elecrolyte during anodizing. The structure of the oxide film was observed directly by carbon replica method(l) and ultra-thin sectioning method(2). The oxide film consists of barrier layer and porous layer constructed with fine hexagonal cellular structure. The diameter of micro pores and the thickness of barrier layer depend on the applying voltage and electrolyte. Because the dimension of the pore corresponds to that of colloidal particles, many metals deposit in the pores. When the oxide film is treated as anode in emulsion of polyelectrolyte, the emulsion particles migrate onto the film and deposit on it. We investigated the behavior of the emulsion particles during electrodeposition.Aluminum foils (99.3%) were anodized in either 0.25M oxalic acid solution at 30°C or 3M sulfuric acid solution at 20°C. After washing with distilled water, the oxide films used as anode were coated with emulsion particles by applying voltage of 200V and then they were cured at 190°C for 30 minutes.

Barrier layer at metal-ceramic interface in ferroelectric MIM structures

1993 ◽  
Vol 3 (8) ◽  
pp. 1617-1623
Author(s):  
P. Gaucher ◽  
J. Hector ◽  
J. P. Ganne
Keyword(s):  
Barrier Layer ◽  
Metal Ceramic

Prediction and assessment of effective state of machinery surface layer at science intensive technologies use

2018 ◽  
Vol 2018 (8) ◽  
pp. 44-48
Author(s):  
В. Бутенко ◽  
V. Butenko
Keyword(s):  
Surface Layer ◽  
Quality Index ◽  
Working Capacity ◽  
Material Quality ◽  
Layer Material ◽  
Operation Characteristics

The assessment indices of surface layer effective state in machinery subjected to different ways of finishing are considered. The role of the dislocation restructurization process in the formation of operation characteristics of surface layer material quality and prediction of its working capacity is shown. A generalized quality index of multi-component functional layers formed on operation surfaces of machinery is described.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

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