scholarly journals Effects of nitric oxide annealing of thermally grown silicon dioxide characteristics

1995 ◽  
Vol 16 (8) ◽  
pp. 345-347 ◽  
Author(s):  
Z.-Q. Yao ◽  
H.B. Harrison ◽  
S. Dimitrijev ◽  
Y.T. Yeow
2005 ◽  
Vol 22 (5-6) ◽  
pp. 201-204 ◽  
Author(s):  
Edward Eteshola ◽  
Leonard J. Brillson ◽  
Stephen Craig Lee

2016 ◽  
Vol 858 ◽  
pp. 465-468 ◽  
Author(s):  
D.P. Ettisserry ◽  
Neil Goldsman ◽  
Akin Akturk ◽  
Aivars J. Lelis

In this work, we investigate the behavior of Nitrogen atoms at 4H-Silicon Carbide (4H-SiC)/Silicon dioxide (SiO2) interface during nitric oxide passivation using ab-initio Density Functional Theory. Our calculations suggest different possible energetically favorable and competing mechanisms by which nitrogen atoms could a) incorporate themselves into the oxide, just above the 4H-SiC substrate, and b) substitute for carbon atoms at the 4H-SiC surface. We attribute the former process to cause increased threshold voltage instability (hole traps), and the latter to result in improved effective mobility through channel counter-doping, apart from removing interface traps in 4H-SiC power MOSFETs. These results support recent electrical and XPS measurements. Additionally, Nitric Oxide passivation is shown to energetically favor re-oxidation of the 4H-SiC surface accompanied by the generation of oxygen vacancies under the conditions considered in this work.


1999 ◽  
Vol 146 (5) ◽  
pp. 1879-1883 ◽  
Author(s):  
Takayuki Aoyama ◽  
Hiroko Tashiro ◽  
Kunihiro Suzuki

2000 ◽  
Vol 39 (Part 1, No. 3B) ◽  
pp. 1487-1489 ◽  
Author(s):  
Shogo Ura ◽  
Toru Nakashiba ◽  
Toshiaki Suhara ◽  
Hiroshi Nishihara ◽  
Paul V. Lambeck

2020 ◽  
Vol 127 (3) ◽  
pp. 034302 ◽  
Author(s):  
K. Filintoglou ◽  
F. Pinakidou ◽  
J. Arvanitidis ◽  
D. Christofilos ◽  
E. C. Paloura ◽  
...  

2008 ◽  
Vol 53 (8) ◽  
pp. 3395-3402 ◽  
Author(s):  
Li Chen ◽  
Yinglin Zhou ◽  
Steffi Krause ◽  
Andres G. Munoz ◽  
Julia Kunze ◽  
...  

1994 ◽  
Vol 342 ◽  
Author(s):  
H. Barry Harrison ◽  
Andrew Misiura ◽  
Sima Dimitrijev ◽  
Denis Sweatman ◽  
Z. Yao ◽  
...  

ABSTRACTIn this paper we review various methods of improving the properties of extremely thin dielectrics (<20 nm) using a nitrogen rich environment. The three main gases considered being ammonia, and nitrous and nitric oxides. We present original results for nitric oxide exposed silicon and suggest that for ultra thin dielectric (<5 nm) that these layers are generally superior to any others, whilst for thicker layers oxides annealed in nitrous oxides appear to display the best properties.


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