Implementation and validation of a new thermal model for analysis, design, and characterization of multichip power electronics devices
1999 ◽
Vol 35
(3)
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pp. 663-669
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2006 ◽
Vol 42
(2)
◽
pp. 270-277
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Keyword(s):
2019 ◽
Vol 9
(5)
◽
pp. 854-863
Keyword(s):
2013 ◽
Vol 61
(7)
◽
pp. 2545-2557
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2004 ◽
Vol 23
(1)
◽
pp. 133-147
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Keyword(s):