2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Chemically enhanced carbon nanotubes based thermal interface materials

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389610 ◽

2015 ◽

Author(s):

J. Daon ◽

S. Sun ◽

D. Jiang ◽

E. Leveugle ◽

C. Galindo ◽

...

Keyword(s):

Carbon Nanotubes ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Interface Materials

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Enhanced thermal characterization method of microscale heatsink structures

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389617 ◽

2015 ◽

Cited By ~ 6

Author(s):

G. Takacs ◽

P. G. Szabo ◽

Gy. Bognar

Keyword(s):

Thermal Characterization

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An application specific additive design methodology for the determination of heatsink geometry topologies

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389600 ◽

2015 ◽

Author(s):

Robin Bomoff ◽

John Parry

Keyword(s):

Design Methodology ◽

Application Specific ◽

Additive Design

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Experimental characterization of DELPHI Compact Thermal Model for surface-mounted soft magnetic composite inductor

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389618 ◽

2015 ◽

Cited By ~ 4

Author(s):

Eric Monier-Vinard ◽

Valentin Bissuel ◽

Najib Laraqi ◽

Olivier Daniel ◽

Didier Signing

Keyword(s):

Thermal Model ◽

Magnetic Composite ◽

Experimental Characterization ◽

Soft Magnetic ◽

Soft Magnetic Composite

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Characterization of thermal vias for 3D ICs using FEM analysis

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389616 ◽

2015 ◽

Author(s):

Melvin Galicia ◽

Piotr Zajac ◽

Cezary Maj ◽

Andrzej Napieralski

Keyword(s):

Fem Analysis ◽

3D Ics

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CFD modelling of thermo-electric devices for thermal management in downhole tools

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389611 ◽

2015 ◽

Cited By ~ 1

Author(s):

Rohitha Weerasinghe ◽

Thomas P. Hughes

Keyword(s):

Thermal Management ◽

Cfd Modelling ◽

Thermo Electric

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The influence of voids in solder joints on thermal performance and reliability investigated with transient thermal analysis

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389623 ◽

2015 ◽

Cited By ~ 10

Author(s):

Alexander Hanss ◽

E Liu ◽

Maximilian Schmid ◽

Gordon Elger

Keyword(s):

Thermal Analysis ◽

Thermal Performance ◽

Solder Joints ◽

Transient Thermal Analysis ◽

Transient Thermal

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Measurement of the in-plane thermal conductivity of SiO2 thin films due to surface phonon-polaritons

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389595 ◽

2015 ◽

Author(s):

Laurent Tranchant ◽

Jose Ordonez-Miranda ◽

Taihei Matsumoto ◽

Sergei Gluchko ◽

Thomas Antoni ◽

...

Keyword(s):

Thin Films ◽

Thermal Conductivity ◽

Surface Phonon ◽

Surface Phonon Polaritons ◽

Phonon Polaritons

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Reduced order modeling of thermal effects in droplet microreactors

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389639 ◽

2015 ◽

Author(s):

Marton Nemeth ◽

Andras Poppe

Keyword(s):

Thermal Effects ◽

Reduced Order Modeling ◽

Reduced Order

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Dynamical behaviour of a far-field radiative thermal transistor

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ◽

10.1109/therminic.2015.7389640 ◽

2015 ◽

Author(s):

Hugo Prod'homme ◽

Younes Ezzahri ◽

Jeremie Drevillon ◽

Karl Joulain

Keyword(s):

Dynamical Behaviour ◽

Far Field

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2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Chemically enhanced carbon nanotubes based thermal interface materials

Enhanced thermal characterization method of microscale heatsink structures

An application specific additive design methodology for the determination of heatsink geometry topologies

Experimental characterization of DELPHI Compact Thermal Model for surface-mounted soft magnetic composite inductor

Characterization of thermal vias for 3D ICs using FEM analysis

CFD modelling of thermo-electric devices for thermal management in downhole tools

The influence of voids in solder joints on thermal performance and reliability investigated with transient thermal analysis

Measurement of the in-plane thermal conductivity of SiO2 thin films due to surface phonon-polaritons

Reduced order modeling of thermal effects in droplet microreactors

Dynamical behaviour of a far-field radiative thermal transistor

Export Citation Format

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Chemically enhanced carbon nanotubes based thermal interface materials

Enhanced thermal characterization method of microscale heatsink structures

An application specific additive design methodology for the determination of heatsink geometry topologies

Experimental characterization of DELPHI Compact Thermal Model for surface-mounted soft magnetic composite inductor

Characterization of thermal vias for 3D ICs using FEM analysis

CFD modelling of thermo-electric devices for thermal management in downhole tools

The influence of voids in solder joints on thermal performance and reliability investigated with transient thermal analysis

Measurement of the in-plane thermal conductivity of SiO2 thin films due to surface phonon-polaritons

Reduced order modeling of thermal effects in droplet microreactors

Dynamical behaviour of a far-field radiative thermal transistor

2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Latest Publications