Correlation of proton and heavy-ion test results on CMOS bulk memories used for space applications

1992 ◽  
Vol 39 (3) ◽  
pp. 450-454 ◽  
Author(s):  
E.G. Stassinopoulos ◽  
J. Borowick
2010 ◽  
Vol 57 (4) ◽  
pp. 2079-2088 ◽  
Author(s):  
Philippe Roche ◽  
Gilles Gasiot ◽  
Slawosz Uznanski ◽  
Jean-Marc Daveau ◽  
Josep Torras-Flaquer ◽  
...  

Author(s):  
A. Kalashnikova ◽  
V. Anashin ◽  
P. Chubunov ◽  
A. Koziukov ◽  
S. Iakovlev ◽  
...  
Keyword(s):  

Robotics ◽  
2021 ◽  
Vol 10 (1) ◽  
pp. 21
Author(s):  
Francesco Samani ◽  
Marco Ceccarelli

TORVEastro robot design is presented with a built prototype in LARM2 (Laboratory of Robot Mechatronics) for testing and characterizing its functionality for service in space stations. Several robot astronauts are designed with bulky human-like structures that cannot be convenient for outdoor space service in monitoring and maintenance of the external structures of orbital stations. The design features of TORVEastro robot are discussed with its peculiar mechanical design with 3 arm-legs as agile service robot astronaut. A lab prototype is used to test the operation performance and the feasibility of its peculiar design. The robot weighs 1 kg, and consists of a central torso, three identical three-degree of freedom (DoF) arm–legs and one vision system. Test results are reported to discuss the operation efficiency in terms of motion characteristics and power consumption during lab experiments that nevertheless show the feasibility of the robot for outdoor space applications.


Author(s):  
M. Sandor ◽  
S. Agarwal ◽  
D. Peters ◽  
M. S. Cooper

Microcircuit manufacturers of Plastic Encapsulated Microcircuits (PEM’s) have made changes in epoxy molding compound materials and chemistry, which lower Glass Transition Temperature (Tg). PEM users in harsh environments have concerns if either the part in its application, or in evaluation or assembly, is used close to, or above, the Tg. Various Tg measurement techniques are available and discussed. Test results from one technique is reviewed. The implications of the Tg results on usage of these parts in space applications will be presented. Burn-in/ reliability test results of samples with low Tg PEM’s will be presented. The reliability experiments include testing under different temperatures. The issue being addressed is whether outgassing of molding compounds occurs when the temperature of the molding compound exceeds the Tg. This is a caution noted by many vendors. As an example outgassing of flame retardants can degrade parametric performance and wire bond integrity. This would be the case when PEMS are being qualified for Space applications using burn-in or in storage environments. JPL’s past experience has shown that COTS PEMS parametrics can degrade significantly even when the burn-in temperature is well below the Tg. Two different microcircuits exhibiting low Tg were evaluated. Assessment of final electrical test measurements and yield are shown.


2012 ◽  
Vol 59 (6) ◽  
pp. 2831-2836 ◽  
Author(s):  
T. R. Oldham ◽  
M. R. Friendlich ◽  
E. P. Wilcox ◽  
K. A. LaBel ◽  
S. P. Buchner ◽  
...  

Author(s):  
R. Ecoffet ◽  
M. Labrunee ◽  
S. Duzellier ◽  
D. Falguere
Keyword(s):  

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