Rapid thermal anneal of gate oxides for low thermal budget TFT's

1999 ◽  
Vol 46 (1) ◽  
pp. 63-69 ◽  
Author(s):  
N. Bhat ◽  
A.W. Wang ◽  
K.C. Saraswat
2002 ◽  
Vol 46 (7) ◽  
pp. 991-995 ◽  
Author(s):  
Alok Sareen ◽  
Ann-Chatrin Lindgren ◽  
Per Lundgren ◽  
Stefan Bengtsson

1996 ◽  
Vol 429 ◽  
Author(s):  
I. Sagnes ◽  
D. Laviale ◽  
M. Regache ◽  
F. Glowacki ◽  
L. Deutschmann ◽  
...  

Numerous nitridation processes have been studied to obtain very thin (≤ 6 nm), reproducible and reliable gate oxides. Recent results (1,2,3) have confirmed that i) the NO molecule is the species responsible for the nitrogen incorporation at the SiO2/Si interface and that ii) the direct use of NO gas allows the gate oxide to be nitrided at low thermal budget whilst maintaining the same advantages as those of N2O nitridation. NO nitridation of very thin oxides has so far been inadequately documented in terms of incorporated nitrogen concentration at the SiO2/Si interface. It is of prime importance to control the incorporation of a few nitrogen monolayers at the SiO2/Si interface, particularly for device performances in the 0. 18μm CMOS technology. In the following we present results on the control of low nitrogen concentration in pure NO atmosphere, with particular emphasis on a method based on the re-oxidation of nitrided oxides. This method can be used in a production line thus avoiding the high costs and long characterization times associated with SIMS measurements.


1997 ◽  
Vol 470 ◽  
Author(s):  
G. Lucovsky ◽  
B. Hinds

ABSTRACTDevice quality gate dielectric heterostructures have been prepared using a three step plasma/rapid thermal sequence [1] in which kinetic effects determine the time-temperature aspects of the processing. The steps for forming the interface and for depositing dielectric layers have been performed at low temperature, ∼300°C, by plasma-assisted processing. Following this a low rapid thermal anneal (RTA) provides interface and bulk dielectric chemical and structural relaxations, thereby yielding device performance and reliability essentially the same as obtained using higher thermal budget conventional or rapid thermal processing.


2010 ◽  
Vol 16 (1) ◽  
pp. 106-113 ◽  
Author(s):  
Kah-Wee Ang ◽  
Tsung-Yang Liow ◽  
Ming-Bin Yu ◽  
Qing Fang ◽  
Junfeng Song ◽  
...  

Author(s):  
Zhicheng Wu ◽  
Jacopo Franco ◽  
Anne Vandooren ◽  
Ben Kaczer ◽  
Philippe Roussel ◽  
...  

2009 ◽  
Vol 12 (9) ◽  
pp. H319 ◽  
Author(s):  
Il-Suk Kang ◽  
Sung-Hun Yu ◽  
Hyun-Sang Seo ◽  
Jeong-Hun Kim ◽  
Jun-Mo Yang ◽  
...  

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