Heat transport across a SiGe nanowire axial junction: Interface thermal resistance and thermal rectification

2014 ◽  
Vol 90 (4) ◽  
Author(s):  
Riccardo Rurali ◽  
Xavier Cartoixà ◽  
Luciano Colombo
Keyword(s):  
Thermal Resistance ◽  
Heat Transport ◽  
Thermal Rectification ◽  
Interface Thermal Resistance

INTERFACE THERMAL RESISTANCE BETWEEN FRENKEL-KONTOROVA AND FERMI-PASTA-ULAM LATTICES

2007 ◽  
Vol 21 (23n24) ◽  
pp. 4013-4016 ◽  
Author(s):  
JINGHUA LAN ◽  
LEI WANG ◽  
BAOWEN LI
Keyword(s):  
Temperature Gradient ◽  
Thermal Resistance ◽  
Kapitza Resistance ◽  
Thermal Rectification ◽  
One Dimensional ◽  
Interface Thermal Resistance ◽  
Phonon Spectra ◽  
Qualitative Relationship

By connecting two dissimilar anharmonic lattices exemplified by Fermi-Pasta-Ulam (FPU) model and Frenkel-kontorova (FK) model, we successfully build up one dimensional thermal diode. We find the rectifying effect is closely related to asymmetric interface thermal resistance (Kapitza resistance). And the asymmetric thermal resistance depends on how the temperature gradient is applied. Moreover, a qualitative relationship between the thermal rectification and the phonon spectra is proposed.

Interface thermal resistance effect on thermal rectification using bulk materials

2015 ◽  
Vol 46 (2) ◽  
pp. 175-183
Author(s):  
Shuang LUO ◽  
Jun WANG ◽  
Jue WANG ◽  
YuXin ZHU ◽  
GuoDong XIA
Keyword(s):  
Thermal Resistance ◽  
Bulk Materials ◽  
Thermal Rectification ◽  
Interface Thermal Resistance

A Technique for Interface Thermal Resistance Measurements Between a Nanoelectrode and a Substrate Using the 3ω Method

2008 ◽  
Author(s):  
Youngsuk Son ◽  
Monalisa Mazumder ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Resistance ◽  
Energy Flow ◽  
Thermoelectric Devices ◽  
3Ω Method ◽  
Interface Thermal Resistance ◽  
Fundamental Understanding ◽  
Nanoscale Interfaces ◽  
Low Dimensional

Developing a fundamental understanding regarding energy flow across nanoscale interfaces is critical in realizing viable nanoelectronics device systems and efficient low-dimensional thermoelectric devices. This work presents investigations of the interface thermal resistance (ITR) in a nanoelectrode-on-substrate system using the DC heating as well as the 3ω method.

Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method

2011 ◽  
Vol 117-119 ◽  
pp. 195-200 ◽  
Author(s):  
Qing Zhi Zhang ◽  
Gang Wu ◽  
Zhi Yang Pang ◽  
Jin Zeng Chen ◽  
Guang Hua Li ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Thermal Resistance ◽  
Experimental Measurement ◽  
Modulation Frequency ◽  
Interface Temperature ◽  
Phase Lag ◽  
Photothermal Method ◽  
Interface Thermal Resistance ◽  
Measurement Results ◽  
Different Temperatures

By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.

Interface thermal resistance of nanostructured FeCoCu film and Si substrate

2006 ◽  
Vol 3 (5) ◽  
pp. 1343-1346
Author(s):  
Yuri M. Nikolaenko ◽  
Yuri V. Medvedev ◽  
Yuri A. Genenko ◽  
Mohammad Ghafari ◽  
Horst Hahn
Keyword(s):  
Thermal Resistance ◽  
Si Substrate ◽  
Interface Thermal Resistance
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