Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)

Algorithmic extension of thermal field solvers: time constant analysis

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837068 ◽

2002 ◽

Cited By ~ 1

Author(s):

V. Szekely ◽

A. Poppe ◽

M. Rencz

Keyword(s):

Time Constant ◽

Thermal Field

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Accurate measurement of interface thermal resistance by means of a transient method

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837080 ◽

2002 ◽

Cited By ~ 17

Author(s):

E.G.T. Bosch ◽

C.J.M. Lasance

Keyword(s):

Thermal Resistance ◽

Transient Method ◽

Interface Thermal Resistance

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The design and testing of the super fiber heat pipes for electronics cooling applications

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837058 ◽

2002 ◽

Cited By ~ 4

Author(s):

I. Sauciuc ◽

M. Mochizuki ◽

K. Mashiko ◽

Y. Saito ◽

T. Nguyen

Keyword(s):

Electronics Cooling ◽

Heat Pipes ◽

Design And Testing

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Thermal testing methods for evaluating thin thermally conductive materials

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837083 ◽

2002 ◽

Author(s):

C. Vogdes ◽

F. Oseguera

Keyword(s):

Thermal Testing ◽

Testing Methods ◽

Conductive Materials ◽

Thermally Conductive

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Modeling of elastic and thermophysical properties of MMC heat sinks with given orientation distribution of the fibers

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837089 ◽

2002 ◽

Author(s):

H.E. Pettermann

Keyword(s):

Thermophysical Properties ◽

Orientation Distribution ◽

Heat Sinks

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Numerical and experimental investigation of a tape ball grid array package

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837077 ◽

2002 ◽

Cited By ~ 4

Author(s):

J. Ewanich ◽

S. Shidore ◽

S. Pashaei-Rad

Keyword(s):

Experimental Investigation ◽

Ball Grid Array ◽

Ball Grid Array Package

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Thermal characterization of single event burnout failure in semiconductor power devices

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837086 ◽

2002 ◽

Cited By ~ 5

Author(s):

D.G. Walker ◽

T.S. Fisher ◽

J. Liu ◽

R.D. Schrimpf

Keyword(s):

Thermal Characterization ◽

Single Event ◽

Power Devices

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Thermal analysis of an electronics enclosure: coupling flow network modeling (FNM) and computational fluid dynamics (CFD)

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837062 ◽

2002 ◽

Cited By ~ 8

Author(s):

T. Kowalski ◽

A. Radmehr

Keyword(s):

Fluid Dynamics ◽

Thermal Analysis ◽

Computational Fluid Dynamics ◽

Network Modeling ◽

Flow Network ◽

Computational Fluid Dynamics Cfd

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Development of the JEDEC forced convection standard

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837074 ◽

2002 ◽

Cited By ~ 1

Author(s):

A. Claassen ◽

B. Joiner ◽

Z. Celik ◽

A. Ortega

Keyword(s):

Forced Convection

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Optimization of parallel plate heatsinks for forced convection

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068) ◽

10.1109/stherm.2000.837093 ◽

2002 ◽

Cited By ~ 32

Author(s):

D. Copeland

Keyword(s):

Forced Convection ◽

Parallel Plate

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Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Algorithmic extension of thermal field solvers: time constant analysis

Accurate measurement of interface thermal resistance by means of a transient method

The design and testing of the super fiber heat pipes for electronics cooling applications

Thermal testing methods for evaluating thin thermally conductive materials

Modeling of elastic and thermophysical properties of MMC heat sinks with given orientation distribution of the fibers

Numerical and experimental investigation of a tape ball grid array package

Thermal characterization of single event burnout failure in semiconductor power devices

Thermal analysis of an electronics enclosure: coupling flow network modeling (FNM) and computational fluid dynamics (CFD)

Development of the JEDEC forced convection standard

Optimization of parallel plate heatsinks for forced convection

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Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Algorithmic extension of thermal field solvers: time constant analysis

Accurate measurement of interface thermal resistance by means of a transient method

The design and testing of the super fiber heat pipes for electronics cooling applications

Thermal testing methods for evaluating thin thermally conductive materials

Modeling of elastic and thermophysical properties of MMC heat sinks with given orientation distribution of the fibers

Numerical and experimental investigation of a tape ball grid array package

Thermal characterization of single event burnout failure in semiconductor power devices

Thermal analysis of an electronics enclosure: coupling flow network modeling (FNM) and computational fluid dynamics (CFD)

Development of the JEDEC forced convection standard

Optimization of parallel plate heatsinks for forced convection

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
Latest Publications