Interface thermal resistance of nanostructured FeCoCu film and Si substrate

2006 ◽  
Vol 3 (5) ◽  
pp. 1343-1346
Author(s):  
Yuri M. Nikolaenko ◽  
Yuri V. Medvedev ◽  
Yuri A. Genenko ◽  
Mohammad Ghafari ◽  
Horst Hahn
Keyword(s):  
Thermal Resistance ◽  
Si Substrate ◽  
Interface Thermal Resistance

A Technique for Interface Thermal Resistance Measurements Between a Nanoelectrode and a Substrate Using the 3ω Method

2008 ◽  
Author(s):  
Youngsuk Son ◽  
Monalisa Mazumder ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Resistance ◽  
Energy Flow ◽  
Thermoelectric Devices ◽  
3Ω Method ◽  
Interface Thermal Resistance ◽  
Fundamental Understanding ◽  
Nanoscale Interfaces ◽  
Low Dimensional

Developing a fundamental understanding regarding energy flow across nanoscale interfaces is critical in realizing viable nanoelectronics device systems and efficient low-dimensional thermoelectric devices. This work presents investigations of the interface thermal resistance (ITR) in a nanoelectrode-on-substrate system using the DC heating as well as the 3ω method.

Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method

2011 ◽  
Vol 117-119 ◽  
pp. 195-200 ◽  
Author(s):  
Qing Zhi Zhang ◽  
Gang Wu ◽  
Zhi Yang Pang ◽  
Jin Zeng Chen ◽  
Guang Hua Li ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Thermal Resistance ◽  
Experimental Measurement ◽  
Modulation Frequency ◽  
Interface Temperature ◽  
Phase Lag ◽  
Photothermal Method ◽  
Interface Thermal Resistance ◽  
Measurement Results ◽  
Different Temperatures

By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.

Heat transport across a gold nanowire/water interface enhanced by the solution ionic strength

2015 ◽  
Vol 1779 ◽  
pp. 33-38 ◽  
Author(s):  
Susil Baral ◽  
Andrew J. Green ◽  
Hugh H. Richardson
Keyword(s):  
Ionic Strength ◽  
Thermal Resistance ◽  
Temperature Change ◽  
Heat Dissipation ◽  
Pure Water ◽  
Gold Nanowires ◽  
Solution Ionic Strength ◽  
Interface Thermal Resistance ◽  
Ionic Solutes ◽  
Surrounding Liquid

ABSTRACTLithographically fabricated gold nanowires are optically excited with 532nm CW laser and the local temperature change is measured in air, pure water and various concentration aqueous solutions of ionic solutes NaCl, Na2SO4 and MgSO4 using the thermal sensor film of Al0.94Ga0.06N embedded with Er3+ ions. The interface thermal resistance for heat transfer from the excited nanowires into the surrounding liquid is determined from the slopes of the temperature change versus laser intensity plots obtained for the nanowire excitation under various solutions. Addition of ionic solute molecules into the solution decreases the interface thermal resistance and hence leads to increased heat dissipation into the surrounding liquid. Interface thermal resistance decreases exponentially with the ionic strength of solution and saturates around zero for solution ionic strength of 0.3M and higher.

Characterisation of high thermal conductivity thin-film substrate systems and their interface thermal resistance

2018 ◽  
Vol 334 ◽  
pp. 233-242 ◽  
Author(s):  
Alireza Moridi ◽  
Liangchi Zhang ◽  
Weidong Liu ◽  
Steven Duvall ◽  
Andrew Brawley ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Thermal Resistance ◽  
High Thermal Conductivity ◽  
Interface Thermal Resistance ◽  
Film Substrate

Thermal Transport through Solid-Solid Interface with an Interlayer

2011 ◽  
Vol 483 ◽  
pp. 750-754
Author(s):  
Ya Dong Liu ◽  
Ke Dong Bi ◽  
Yun Fei Chen ◽  
Min Hua Chen
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Thermal Resistance ◽  
Thermal Transport ◽  
System Size ◽  
Simulation System ◽  
Nonequilibrium Molecular Dynamics ◽  
Solid Interface ◽  
Interface Thermal Resistance ◽  
System Temperature

Nonequilibrium molecular dynamics (NEMD) approach is developed to investigate the thermal transport across a solid-solid interface between two different materials with an interlayer around it. The effects of system size and the interlayer material’s properties on the interface thermal resistance are considered in our model. The NEMD simulations show that the addition of an interlayer between two highly dissimilar lattices depresses the interface thermal resistance effectively. Meanwhile, the effective thermal conductivity along the direction of heat flux is enhanced with the increasing system temperature. Moreover, the interface thermal resistance after including an interlayer does not depend strongly on the simulation system size.

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