Asymmetric extreme ultraviolet scattering from sputter-deposited multilayers

1999 ◽  
Vol 59 (20) ◽  
pp. 13273-13277 ◽  
Author(s):  
E. M. Gullikson ◽  
D. G. Stearns
Keyword(s):  
Extreme Ultraviolet ◽  
Sputter Deposited ◽  
Ultraviolet Scattering

scholarly journals Colloidal crystal order and structure revealed by tabletop extreme ultraviolet scattering and coherent diffractive imaging

2018 ◽  
Vol 26 (9) ◽  
pp. 11393 ◽  
Author(s):  
Giulia F. Mancini ◽  
Robert M. Karl ◽  
Elisabeth R. Shanblatt ◽  
Charles S. Bevis ◽  
Dennis F. Gardner ◽  
...  
Keyword(s):  
Extreme Ultraviolet ◽  
Colloidal Crystal ◽  
Diffractive Imaging ◽  
Coherent Diffractive Imaging ◽  
Ultraviolet Scattering

scholarly journals High-resolution resonant inelastic extreme ultraviolet scattering from orbital and spin excitations in a Heisenberg antiferromagnet

2017 ◽  
Vol 96 (18) ◽  
Author(s):  
Antonio Caretta ◽  
Martina Dell'Angela ◽  
Yi-De Chuang ◽  
Alexandra M. Kalashnikova ◽  
Roman V. Pisarev ◽  
...  
Keyword(s):  
High Resolution ◽  
Extreme Ultraviolet ◽  
Heisenberg Antiferromagnet ◽  
Spin Excitations ◽  
Ultraviolet Scattering

scholarly journals Direct observation of spin-orbit-induced 3d hybridization via resonant inelastic extreme ultraviolet scattering on an edge-sharing cuprate

2019 ◽  
Vol 99 (11) ◽  
Author(s):  
Marco Malvestuto ◽  
Antonio Caretta ◽  
Barbara Casarin ◽  
Roberta Ciprian ◽  
Martina Dell'Angela ◽  
...  
Keyword(s):  
Direct Observation ◽  
Extreme Ultraviolet ◽  
Spin Orbit ◽  
Ultraviolet Scattering

Crystal Structure Analysis of Cu-Zr Alloys by Convergent Beam Diffraction

1981 ◽  
Vol 39 ◽  
pp. 354-355
Author(s):  
A. F. Marshall ◽  
J. W. Steeds ◽  
D. Bouchet ◽  
S. L. Shinde ◽  
R. G. Walmsley
Keyword(s):  
Crystal Structure ◽  
Point Group ◽  
Intermetallic Phase ◽  
Three Dimensional ◽  
Crystal Structure Analysis ◽  
Ion Milling ◽  
Composition And Structure ◽  
Unit Cells ◽  
Sputter Deposited ◽  
Convergent Beam

Convergent beam electron diffraction is a powerful technique for determining the crystal structure of a material in TEM. In this paper we have applied it to the study of the intermetallic phases in the Cu-rich end of the Cu-Zr system. These phases are highly ordered. Their composition and structure has been previously studied by microprobe and x-ray diffraction with sometimes conflicting results.The crystalline phases were obtained by annealing amorphous sputter-deposited Cu-Zr. Specimens were thinned for TEM by ion milling and observed in a Philips EM 400. Due to the large unit cells involved, a small convergence angle of diffraction was used; however, the three-dimensional lattice and symmetry information of convergent beam microdiffraction patterns is still present. The results are as follows:1) 21 at% Zr in Cu: annealed at 500°C for 5 hours. An intermetallic phase, Cu3.6Zr (21.7% Zr), space group P6/m has been proposed near this composition (2). The major phase of our annealed material was hexagonal with a point group determined as 6/m.

Characterization of reactive phase formation in sputter-deposited Ni/Al multilayer thin films using TEM

1996 ◽  
Vol 54 ◽  
pp. 1000-1001
Author(s):  
G. Lucadamo ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Dark Field ◽  
Nickel Layer ◽  
Multilayer Thin Films ◽  
Cross Sectional ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
Constant Heating

The subject of reactive phase formation in multilayer thin films of varying periodicity has stimulated much research over the past few years. Recent studies have sought to understand the reactions that occur during the annealing of Ni/Al multilayers. Dark field imaging from transmission electron microscopy (TEM) studies in conjunction with in situ x-ray diffraction measurements, and calorimetry experiments (isothermal and constant heating rate), have yielded new insights into the sequence of phases that occur during annealing and the evolution of their microstructure.In this paper we report on reactive phase formation in sputter-deposited lNi:3Al multilayer thin films with a periodicity A (the combined thickness of an aluminum and nickel layer) from 2.5 to 320 nm. A cross-sectional TEM micrograph of an as-deposited film with a periodicity of 10 nm is shown in figure 1. This image shows diffraction contrast from the Ni grains and occasionally from the Al grains in their respective layers.

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