scholarly journals Using Activated Transport in Parallel Nanowires for Energy Harvesting and Hot-Spot Cooling

2015 ◽  
Vol 3 (5) ◽  
Author(s):  
Riccardo Bosisio ◽  
Cosimo Gorini ◽  
Geneviève Fleury ◽  
Jean-Louis Pichard
Keyword(s):  
Energy Harvesting ◽  
Hot Spot ◽  
Spot Cooling

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Mini-Contact Enhanced Thermoelectric Coolers for On-Chip Hot Spot Cooling

2009 ◽  
Vol 30 (9) ◽  
pp. 736-743 ◽  
Author(s):  
Peng Wang ◽  
Bao Yang ◽  
Avram Bar-Cohen
Keyword(s):  
Hot Spot ◽  
Thermoelectric Coolers ◽  
Spot Cooling ◽  
On Chip

Active Hot Spot Cooling Controlled by Single-Sided Electrowetting-on-Dielectric (SEWOD)

2012 ◽  
Author(s):  
Sung-Yong Park ◽  
Jiangtao Cheng ◽  
Chung-Lung (C.-L. ) Chen
Keyword(s):  
Heat Transfer ◽  
Fluid Transport ◽  
Hot Spot ◽  
Two Phase ◽  
Electrowetting On Dielectric ◽  
Transfer Capability ◽  
Heat Transfer Capability ◽  
Spot Cooling ◽  
On Chip ◽  
Two Phase Cooling

Electrowetting-on-dielectric (EWOD) has attracted as one of the effective on-chip cooling technologies. It enables rapid transport of coolant droplets and heat transfer from target heat sources, while consuming extremely low power for fluid transport. However, a sandwiched configuration in conventional EWOD devices only allows sensible heat transfer, which very limits heat transfer capability of the device. In this paper, we report a novel single-sided EWOD (SEWOD) technology that enables two-phase cooling on a single-sided plate. As a result, heat transfer capability of the SEWOD device can be significantly enhanced. A complete set of droplet manipulation functions necessary for active hot spot cooling has been achieved on SEWOD. Hot spot surface modification to hydrophilic makes a droplet stick on a hot spot and maximize its contact area, greatly improving thermal rejection capability of the device. We have demonstrated two-phase cooling on SEWOD. With successive transportation of four droplets with a volume of 30 μL, the hot spot temperature that was initially heated up to 172°C was able to be stably maintained below 100 °C for 475s. This novel SEWOD-driven cooling technique promises to potentially function as a wickless vapor chamber with enhanced thermal managing capabilities.

Analysis of Nanowire Heat Pumps for Local Hot Spot Cooling

2008 ◽  
Author(s):  
Eduardo Castillo ◽  
Ganapathiraman Ramanath ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
Hot Spot ◽  
Heat Pumps ◽  
Junction Temperature ◽  
Peltier Effect ◽  
Constant Distance ◽  
Spot Cooling ◽  
Conventional Cooling

Conventional cooling techniques cannot be effectively employed in thermal management of high flux microscale to nanoscale hot spots that will occur in new generations of nanoelectronics and interconnects. Solid-state nanoscale heat pumps based on the Peltier effect have been proposed to alleviate the hot spot by producing a localized cooling effect in the vicinity of the hot spot. The proximity to the hot spot is expected to lead to efficient hot spot removal. In addition, such nanowire heat pumps may have higher coefficients of performance than their bulk materials counterparts due to enhanced thermoelectric figure of merit in optimized nanostructures. In this work nanoscale heat pumps are assumed to be assembled either parallel or perpendicular to the substrate around the hot spot with the cold junctions in contact with the hot spot and the hot junctions distributed at a constant distance from the hot spot. The objective of this work is to quantify and optimize the heat transfer rate of the nanoscale heat pump devices. An analytical model is employed to predict the heat transfer rate attainable with nanowire devices and their dependence on nanowire and hot spot dimensions, the junction temperature, and heat flux from the heat spot. Experimental efforts are on the way to demonstrate such devices.

Hot Spot Cooling Using Recycled Energy

2007 ◽  
Author(s):  
Chien Ouyang ◽  
Kenny Gross ◽  
Ali Heydari
Keyword(s):  
Energy Efficiency ◽  
Solid State ◽  
Waste Heat ◽  
Hot Spot ◽  
Thermal Gradients ◽  
Novel Approach ◽  
State Technique ◽  
Spot Cooling ◽  
Wasted Energy

The paper describes a novel approach for achieving enhanced energy efficiency for computer servers. The paper teaches a novel solid-state technique and apparatus for recycling waste heat from chip packages and turning that wasted energy into hot-spot cooling for other IC packages in the same server. This approach brings the combined advantages of enhanced energy efficiency while smoothing out the spatial and temporal thermal gradients, thereby yielding better long term reliability for multiple-chip enterprise servers.

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

2011 ◽  
Author(s):  
Matthew Redmond ◽  
Kavin Manickaraj ◽  
Owen Sullivan ◽  
Satish Kumar
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Power Density ◽  
Hot Spot ◽  
Thermal Contact ◽  
Three Dimensional ◽  
Heat Removal ◽  
Thermoelectric Coolers ◽  
Vertical Coupling ◽  
Spot Cooling

Three dimensional (3D) technologies with stacked chips have the potential to provide new chip architecture, improved device density, performance, efficiency, and bandwidth. Their increased power density also can become a daunting challenge for heat removal. Furthermore, power density can be highly non-uniform leading to time and space varying hotspots which can severely affect performance and reliability of the integrated circuits. Thus, it is important to mitigate thermal gradients on chip while considering the associated cooling costs. One method of thermal management currently under investigation is the use of superlattice thermoelectric coolers (TECs) which can be employed for on demand and localized cooling. In this paper, a detailed 3D thermal model of a stacked electronic package with two dies and four ultrathin integrated TECs is studied in order to investigate the efficacy of TECs in hot spot cooling for a 3D technology. We observe up to 14.6 °C of cooling at a hot spot inside the package by TECs. A strong vertical coupling has been observed between the TECs located in top and bottom dies. Bottom TECs can detrimentally heat the top hotspots in both steady state and transient operation. TECs need to be carefully placed inside the package to avoid such undesired heating. Thermal contact resistances between dies, inside the TEC module, and between the TEC and heat spreader are shown to have a crucial effect on TEC performance inside the package. We observed that square root current pulse can provide very efficient short-duration transient cooling at hotspots.

Sign in / Sign up

Export Citation Format

Share Document