Active Hot Spot Cooling Controlled by Single-Sided Electrowetting-on-Dielectric (SEWOD)

2012 ◽  
Author(s):  
Sung-Yong Park ◽  
Jiangtao Cheng ◽  
Chung-Lung (C.-L. ) Chen
Keyword(s):  
Heat Transfer ◽  
Fluid Transport ◽  
Hot Spot ◽  
Two Phase ◽  
Electrowetting On Dielectric ◽  
Transfer Capability ◽  
Heat Transfer Capability ◽  
Spot Cooling ◽  
On Chip ◽  
Two Phase Cooling

Electrowetting-on-dielectric (EWOD) has attracted as one of the effective on-chip cooling technologies. It enables rapid transport of coolant droplets and heat transfer from target heat sources, while consuming extremely low power for fluid transport. However, a sandwiched configuration in conventional EWOD devices only allows sensible heat transfer, which very limits heat transfer capability of the device. In this paper, we report a novel single-sided EWOD (SEWOD) technology that enables two-phase cooling on a single-sided plate. As a result, heat transfer capability of the SEWOD device can be significantly enhanced. A complete set of droplet manipulation functions necessary for active hot spot cooling has been achieved on SEWOD. Hot spot surface modification to hydrophilic makes a droplet stick on a hot spot and maximize its contact area, greatly improving thermal rejection capability of the device. We have demonstrated two-phase cooling on SEWOD. With successive transportation of four droplets with a volume of 30 μL, the hot spot temperature that was initially heated up to 172°C was able to be stably maintained below 100 °C for 475s. This novel SEWOD-driven cooling technique promises to potentially function as a wickless vapor chamber with enhanced thermal managing capabilities.

On-Chip Two-Phase Cooling With Refrigerant 85 $\mu{\rm m}$-Wide Multi-Microchannel Evaporator Under Hot-Spot Conditions

2012 ◽  
Vol 2 (2) ◽  
pp. 311-320 ◽  
Author(s):  
Etienne Costa-Patry ◽  
Stefano Nebuloni ◽  
Jonathan Olivier ◽  
John Richard Thome
Keyword(s):  
Hot Spot ◽  
Two Phase ◽  
On Chip ◽  
Two Phase Cooling

Investigation of On-Chip Hot Spot Cooling Using Microchannel Heat Sink

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Spot Cooling ◽  
On Chip

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

scholarly journals The Exergy Loss Distribution and the Heat Transfer Capability in Subcritical Organic Rankine Cycle

Entropy ◽  
2017 ◽  
Vol 19 (6) ◽  
pp. 256 ◽  
Author(s):  
Chao He ◽  
Youzhou Jiao ◽  
Chaochao Tian ◽  
Zhenfeng Wang ◽  
Zhiping Zhang
Keyword(s):  
Heat Transfer ◽  
Organic Rankine Cycle ◽  
Rankine Cycle ◽  
Exergy Loss ◽  
Loss Distribution ◽  
Transfer Capability ◽  
Heat Transfer Capability
Sign in / Sign up

Export Citation Format

Share Document