scholarly journals Microscopic piezoelectric behavior of clamped and membrane (001) PMN-30PT thin films

2021 ◽  
Vol 119 (20) ◽  
pp. 202903
Author(s):  
A. Brewer ◽  
S. Lindemann ◽  
B. Wang ◽  
W. Maeng ◽  
J. Frederick ◽  
...  
2012 ◽  
Vol 112 (5) ◽  
pp. 052018 ◽  
Author(s):  
J. J. Gervacio-Arciniega ◽  
E. Prokhorov ◽  
F. J. Espinoza-Beltrán ◽  
G. Trapaga

2014 ◽  
Vol 25 (4) ◽  
pp. 1696-1702 ◽  
Author(s):  
M. Khodaei ◽  
Daehee Seol ◽  
S. A. Seyyed Ebrahimi ◽  
Yong Jun Park ◽  
Hosung Seo ◽  
...  

2007 ◽  
Vol 351 (1) ◽  
pp. 15-24 ◽  
Author(s):  
M. Detalle ◽  
R. Herdier ◽  
G. S. Wang ◽  
D. Remiens ◽  
P. Roussel ◽  
...  

2008 ◽  
Vol 93 (14) ◽  
pp. 142902 ◽  
Author(s):  
A. Z. Simões ◽  
A. H. M. Gonzalez ◽  
E. C. Aguiar ◽  
C. S. Riccardi ◽  
E. Longo ◽  
...  

2021 ◽  
Vol 118 (1) ◽  
pp. 012904
Author(s):  
S. Kirbach ◽  
M. Lederer ◽  
S. Eßlinger ◽  
C. Mart ◽  
M. Czernohorsky ◽  
...  

2000 ◽  
Vol 77 (3) ◽  
pp. 438-440 ◽  
Author(s):  
V. Nagarajan ◽  
S. P. Alpay ◽  
C. S. Ganpule ◽  
B. K. Nagaraj ◽  
S. Aggarwal ◽  
...  

1999 ◽  
Vol 75 (26) ◽  
pp. 4183-4185 ◽  
Author(s):  
V. Nagarajan ◽  
C. S. Ganpule ◽  
B. Nagaraj ◽  
S. Aggarwal ◽  
S. P. Alpay ◽  
...  

Author(s):  
L.J. Chen ◽  
Y.F. Hsieh

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.


Author(s):  
R. C. Moretz ◽  
G. G. Hausner ◽  
D. F. Parsons

Use of the electron microscope to examine wet objects is possible due to the small mass thickness of the equilibrium pressure of water vapor at room temperature. Previous attempts to examine hydrated biological objects and water itself used a chamber consisting of two small apertures sealed by two thin films. Extensive work in our laboratory showed that such films have an 80% failure rate when wet. Using the principle of differential pumping of the microscope column, we can use open apertures in place of thin film windows.Fig. 1 shows the modified Siemens la specimen chamber with the connections to the water supply and the auxiliary pumping station. A mechanical pump is connected to the vapor supply via a 100μ aperture to maintain steady-state conditions.


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