scholarly journals Thermal management strategies for gallium oxide vertical trench-fin MOSFETs

2021 ◽  
Vol 129 (8) ◽  
pp. 085301
Author(s):  
Robert H. Montgomery ◽  
Yuewei Zhang ◽  
Chao Yuan ◽  
Samuel Kim ◽  
Jingjing Shi ◽  
...  
Keyword(s):  
Thermal Management ◽  
Gallium Oxide ◽  
Management Strategies

Electrochemical-Thermal Modeling to Evaluate Battery Thermal Management Strategies

2014 ◽  
Vol 162 (1) ◽  
pp. A137-A148 ◽  
Author(s):  
Todd Bandhauer ◽  
Srinivas Garimella ◽  
Thomas F. Fuller
Keyword(s):  
Thermal Management ◽  
Thermal Modeling ◽  
Management Strategies ◽  
Battery Thermal Management

scholarly journals Device-Level Thermal Management of Gallium Oxide Field-Effect Transistors

2019 ◽  
Vol 9 (12) ◽  
pp. 2352-2365 ◽  
Author(s):  
Bikramjit Chatterjee ◽  
Ke Zeng ◽  
Christopher D. Nordquist ◽  
Uttam Singisetti ◽  
Sukwon Choi
Keyword(s):  
Thermal Management ◽  
Gallium Oxide ◽  
Field Effect ◽  
Field Effect Transistors

Operating Conditions and System Considerations for a Reversible Solid Oxide Cell System for Electrical Energy Storage

2014 ◽  
Author(s):  
Christopher H. Wendel ◽  
Pejman Kazempoor ◽  
Robert J. Braun
Keyword(s):  
Energy Storage ◽  
Thermal Management ◽  
Management Strategies ◽  
Electrical Energy ◽  
Cell System ◽  
Operating Conditions ◽  
Solid Oxide ◽  
System Level ◽  
Widespread Application ◽  
Electrical Energy Storage

Electrical energy storage (EES) is an important component of the future electric grid. Given that no other widely available technology meets all the EES requirements, reversible (or regenerative) solid oxide cells (ReSOCs) working in both fuel cell (power producing) and electrolysis (fuel producing) modes are envisioned as a technology capable of providing highly efficient and cost-effective EES. However, there are still many challenges from cell materials development to system level operation of ReSOCs that should be addressed before widespread application. One particular challenge of this novel system is establishing effective thermal management strategies to maintain the high conversion efficiency of the ReSOC. The system presented in this paper employs a thermal management strategy of promoting exothermic methanation in the ReSOC stack to offset the endothermic electrolysis reactions during charging mode (fuel producing) while also enhancing the energy density of the stored gases. Modeling and parametric analysis of an energy storage concept is performed using a thermodynamic system model coupled with a physically based ReSOC stack model. Results indicate that roundtrip efficiencies greater than 70% can be achieved at intermediate stack temperature (∼680°C) and pressure (∼20 bar). The optimal operating conditions result from a tradeoff between high stack efficiency and high parasitic balance of plant power.

Thermal Analysis of High Efficiency High Speed Drives

2019 ◽  
Author(s):  
Yasmin Khakpour ◽  
Weilun Warren Chen ◽  
Parikshith Channegowda ◽  
Matthew R. Pearson ◽  
Yongduk Lee ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Thermal Resistance ◽  
Power Electronics ◽  
Thermal Management ◽  
High Speed ◽  
High Efficiency ◽  
Management Strategies ◽  
Substantial Reduction ◽  
Operating Conditions ◽  
Heat Conducting

Abstract The thermal management of the PCB based power electronics is a key element to ensure safe operating conditions and to meet lifetime, reliability and safety requirements. This is challenging for applications above 1 kW because the substrate material used in a PCB such as FR-4 has very low heat conducting properties. Hence, there is a limit on how much loss can be dissipated from the board and for that reason this approach has only been adopted in the industry for very low power applications. With the proposed multilevel topology, WBG devices, and innovative thermal management strategies it is possible to expand the PCB based power electronics approach to power ratings between 1kW and 10 kW. For instance, an improvement in the thermal resistance of the PCB can be obtained by soldering a discrete WBG device with a TO-263 package directly on a PCB with about one inch square copper area around the device which will act as a heat spreader. Then, a further substantial reduction in the thermal resistance of a PCB is possible by the application of electrical vias. In principle each via is a copper sleeve through the board or through a part of the board. Where, instead of using its electrical function, a via can also be used as a thermal conductor. In this work, the thermal analysis of the PCB and the effect of number of vias as well as the effect of filling the vias with a thermally conductive material has been studied. The design has been optimized for the number of vias and the modeling results have been verified with experimental tests.

Modeling and analysis for thermal management in gallium oxide field-effect transistors

2020 ◽  
Vol 127 (15) ◽  
pp. 154502
Author(s):  
Chao Yuan ◽  
Yuewei Zhang ◽  
Robert Montgomery ◽  
Samuel Kim ◽  
Jingjing Shi ◽  
...  
Keyword(s):  
Thermal Management ◽  
Gallium Oxide ◽  
Field Effect ◽  
Field Effect Transistors ◽  
Modeling And Analysis

Thermal management strategies for high power semiconductor pump lasers

2006 ◽  
Vol 29 (2) ◽  
pp. 268-276 ◽  
Author(s):  
Xingsheng Liu ◽  
M.H. Hu ◽  
C.G. Caneau ◽  
R. Bhat ◽  
Chung-En Zah
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Management Strategies ◽  
Power Semiconductor ◽  
Pump Lasers

Measurements of Heat Release of Diesel PM for Advanced Thermal Management Strategies for DPF Regeneration

2011 ◽  
Vol 183 (12) ◽  
pp. 1328-1341 ◽  
Author(s):  
Hwan S. Chong ◽  
Suresh K. Aggarwal ◽  
Kyeong O. Lee ◽  
Seung Y. Yang
Keyword(s):  
Heat Release ◽  
Thermal Management ◽  
Management Strategies ◽  
Dpf Regeneration
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