Modeling and analysis for thermal management in gallium oxide field-effect transistors

2020 ◽  
Vol 127 (15) ◽  
pp. 154502
Author(s):  
Chao Yuan ◽  
Yuewei Zhang ◽  
Robert Montgomery ◽  
Samuel Kim ◽  
Jingjing Shi ◽  
...  
Author(s):  
Bikramjit Chatterjee ◽  
Ke Zeng ◽  
Christopher D. Nordquist ◽  
Uttam Singisetti ◽  
Sukwon Choi

2019 ◽  
Vol 28 (1) ◽  
pp. 017105 ◽  
Author(s):  
Zeng Liu ◽  
Pei-Gang Li ◽  
Yu-Song Zhi ◽  
Xiao-Long Wang ◽  
Xu-Long Chu ◽  
...  

2005 ◽  
Vol 892 ◽  
Author(s):  
Hangfeng Ji ◽  
Andrei Sarua ◽  
Martin Kuball ◽  
Jo Das ◽  
Wouter Ruythooren ◽  
...  

AbstractWe report on a temperature study of flip-chip mounted multi-finger AlGaN/GaN heterostructure field effect transistors (HFETs) using micro-Raman spectroscopy and infrared (IR) thermography. Flip-chip mounting can be used to improve thermal device management, in particular, for devices grown on low thermal conductivity substrates such as sapphire. In this study, we compare two flip-chip mounted HFETs of different flip-chip contact bump layout designs and a non flip-chip mounted HFET. Both temperature measurements and 3D temperature simulations are presented. The results show that minimizing the distance between the bumps and the active area of the HFET is essential for obtaining a low device operating temperature.


Author(s):  
Hang Dong ◽  
Guangwei Xu ◽  
Xuanze Zhou ◽  
Wenhao Xiong ◽  
Xueqiang Xiang ◽  
...  

2012 ◽  
Vol 100 (1) ◽  
pp. 013504 ◽  
Author(s):  
Masataka Higashiwaki ◽  
Kohei Sasaki ◽  
Akito Kuramata ◽  
Takekazu Masui ◽  
Shigenobu Yamakoshi

2014 ◽  
Vol 04 (03) ◽  
pp. 119-127 ◽  
Author(s):  
Jihen Chermiti ◽  
Sawsen Azzouzi ◽  
Mounir Ben Ali ◽  
Mhamed Trabelsi ◽  
Abdelhamid Errachid

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