Large‐area defect‐free silicon‐on‐insulator films by zone‐melt recrystallization

1988 ◽  
Vol 52 (11) ◽  
pp. 901-903 ◽  
Author(s):  
R. Pandya ◽  
A. Martinez
1990 ◽  
Vol 188 ◽  
Author(s):  
Ingrid De Wolf ◽  
Jan Vanhellemont ◽  
Herman E. Maes

ABSTRACTMicro Raman spectroscopy (RS) is used to study the crystalline quality and the stresses in the thin superficial silicon layer of Silicon-On-Insulator (SO) materials. Results are presented for SIMOX (Separation by IMplanted OXygen) and ZMR (Zone Melt Recrystallized) substrates. Both as implanted and annealed SIMOX structures are investigated. The results from the as implanted structures are correlated with spectroscopic ellipsometry (SE) and cross-section transmission electron microscopy (TEM) analyses on the same material. Residual stress in ZMR substrates is studied in low- and high temperature gradient regions.


2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Masanobu Iwanaga ◽  
Bongseok Choi ◽  
Hideki T. Miyazaki ◽  
Yoshimasa Sugimoto ◽  
Kazuaki Sakoda

We show an effective procedure for lateral structure tuning in nanoimprint lithography (NIL) that has been developed as a vertical top-down method fabricating large-area nanopatterns. The procedure was applied to optical resonance tuning in stacked complementary (SC) metasurfaces based on silicon-on-insulator (SOI) substrates and was found to realize structure tuning at nm precision using only one mold in the NIL process. The structure tuning enabled us to obtain fine tuning of the optical resonances, offering cost-effective, high-throughput, and high-precision nanofabrication. We also demonstrate that the tuned optical resonances selectively and significantly enhance fluorescence (FL) of dye molecules in a near-infrared range. FL intensity on a SC metasurface was found to be more than 450-fold larger than the FL intensity on flat Au film on base SOI substrate.


1988 ◽  
Vol 130 ◽  
Author(s):  
Theodore J. Letavic ◽  
Edward W. Maby ◽  
Ronald J. Gutmann

AbstractA high-temperature viscoelastic stress relief technique has been investigated as a means for reducing in-plane stress encountered during zone-melt recrystallization of patterned silicon-on-insulator structures. This technique incorporates a phosphosilicate glass layer between the silicon film and the insulating substrate to provide a viscous flow mechanism for stress relief within the composite structure. The stress relaxation can bequalitatively described by a mechanical model which couples thermal expansion and viscoelastic flow. The model predicts the time constant for stress relief at high temperatures as a function of pattern size, and the results are useful as a design aid for zone-melt recrystallization experiments.


Optica ◽  
2017 ◽  
Vol 4 (9) ◽  
pp. 1147 ◽  
Author(s):  
Christopher J. Sarabalis ◽  
Yanni D. Dahmani ◽  
Rishi N. Patel ◽  
Jeff T. Hill ◽  
Amir H. Safavi-Naeini

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