Electrical activity of defects in molecular beam epitaxially grown GaAs on Si and its reduction by rapid thermal annealing

1987 ◽  
Vol 51 (13) ◽  
pp. 1013-1015 ◽  
Author(s):  
N. Chand ◽  
R. Fischer ◽  
A. M. Sergent ◽  
D. V. Lang ◽  
S. J. Pearton ◽  
...  
1986 ◽  
Vol 49 (13) ◽  
pp. 815-817 ◽  
Author(s):  
N. Chand ◽  
R. People ◽  
F. A. Baiocchi ◽  
K. W. Wecht ◽  
A. Y. Cho

1987 ◽  
Vol 102 ◽  
Author(s):  
M. Cerullo ◽  
Julia M. Phillips ◽  
M. Anzlowar ◽  
L. Pfeiffer ◽  
J. L. Batstone ◽  
...  

ABSTRACTA new in-situ rapid thermal annealing (RTA) apparatus which can be used to anneal entire wafers in an ultra high vacuum environment has been designed to be used in conjunction with the epitaxial growth of heterostructures. Drastic improvement in the crystallinity of CaF2/Si(100) can be achieved with RTA, and our results suggest that RTA can be used as an on-line processing technique for novel epitaxial structures.


1988 ◽  
Vol 144 ◽  
Author(s):  
B.J. Skromme ◽  
N.G. Stoffel ◽  
A.S. Gozdz ◽  
M.C. Tamargo ◽  
S.M. Shibli

ABSTRACTWe describe the effects of rapid thermal annealing on the photoluminescence (PL) and electrical properties of heteroepitaxial ZnSe grown by molecular beam epitaxy on GaAs, using either no cap or plasma-deposited SiO2, Si3N4, or diamond-like C caps, and annealing temperatures from 500 to 800°C. Capless anneals (in contact with GaAs) produce badly degraded PL properties, while capped anneals can prevent this degradation. We show that Si3N4 is significantly more effective in preventing Zn out-diffusion through t e cap than previously employed SiO2 films, as evidenced by less pronounced PL features related to the creation of Zn vacancies during the anneal. Implant damage tends to enhance the Zn vacancy formation. Rapid thermal annealing with Si3N4 caps is shown to optically activate shallow N acceptor implants.


2006 ◽  
Vol 99 (3) ◽  
pp. 034903 ◽  
Author(s):  
H. Zhao ◽  
Y. Q. Xu ◽  
H. Q. Ni ◽  
S. Y. Zhang ◽  
D. H. Wu ◽  
...  

1988 ◽  
Vol 100 ◽  
Author(s):  
A. R. Von Neida ◽  
K. T. Short ◽  
J. M. Brown ◽  
S. J. Pearton

ABSTRACTWe have studied in some detail the activation of implanted Si and Mg ions in InAs, GaSb and GaP after rapid thermal annealing. Even at doses of 1015 cm−2, the activation percentage of Mg is relatively high after optimum anneals -80% in GaP, 55% in GaSb and 45% in InAs. There is considerable outdiffusion of Mg in all three semiconductors for extended heat treatments. The amphoteric species Si shows good activation (60% for 1015 cm−2 dose) in InAs, a saturation electrically active concentration of ∼3 × 1013 cm−2 in GaP, and very low electrical activity in GaSb. The regrowth and damage removal characteristics in the three materials are similar to those of GaAs and InP.


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