scholarly journals Very high frequency GaAlAs laser field‐effect transistor monolithic integrated circuit

1982 ◽  
Vol 41 (2) ◽  
pp. 126-128 ◽  
Author(s):  
Israel Ury ◽  
Kam Y. Lau ◽  
Nadav Bar‐Chaim ◽  
Amnon Yariv
Keyword(s):  
Integrated Circuit ◽  
High Frequency ◽  
Laser Field ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Monolithic Integrated Circuit ◽  
Very High Frequency ◽  
Effect Transistor ◽  
Very High

Comparison of Bipolar and Unipolar SiC Switching Devices for Very High Power Applications

2007 ◽  
Vol 556-557 ◽  
pp. 975-978
Author(s):  
Kent Bertilsson ◽  
Chris I. Harris
Keyword(s):  
Field Effect ◽  
Field Effect Transistor ◽  
Static Case ◽  
Simulation Studies ◽  
Drift Diffusion ◽  
Element Approach ◽  
Effect Transistor ◽  
Unipolar Devices ◽  
Very High ◽  
Drift Layer

Both unipolar and injection SiC devices can be used for high voltage switching applications; it is not determined, however, for which applications one approach is preferred over the other. In this paper, simulation studies are used to compare the suitability of unipolar devices, in this case a JFET (Junction Field Effect Transistor) against an equivalent FCD (Field Controlled Diode) configuration up to very high voltages. The calculations are performed in a finite element approach, with commercial drift-diffusion software. Numerous drift layers have been simulated in a Monte-Carlo approach to ensure that the optimal design of the drift layers for different breakdown is used. In a static case, purely conductive losses in the drift layer in both unipolar and injection configuration are compared. Additionally the total losses are studied and compared in switched applications for different switching frequencies and current levels.

scholarly journals Numerical Evaluation of the Effect of Geometric Tolerances on the High-Frequency Performance of Graphene Field-Effect Transistors

Nanomaterials ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 3121
Author(s):  
Monica La Mura ◽  
Patrizia Lamberti ◽  
Vincenzo Tucci
Keyword(s):  
High Frequency ◽  
Communication Systems ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Field Effect Transistors ◽  
Channel Length ◽  
Geometrical Parameters ◽  
Effect Transistor ◽  
Rf Performance ◽  
The Impact

The interest in graphene-based electronics is due to graphene’s great carrier mobility, atomic thickness, resistance to radiation, and tolerance to extreme temperatures. These characteristics enable the development of extremely miniaturized high-performing electronic devices for next-generation radiofrequency (RF) communication systems. The main building block of graphene-based electronics is the graphene-field effect transistor (GFET). An important issue hindering the diffusion of GFET-based circuits on a commercial level is the repeatability of the fabrication process, which affects the uncertainty of both the device geometry and the graphene quality. Concerning the GFET geometrical parameters, it is well known that the channel length is the main factor that determines the high-frequency limitations of a field-effect transistor, and is therefore the parameter that should be better controlled during the fabrication. Nevertheless, other parameters are affected by a fabrication-related tolerance; to understand to which extent an increase of the accuracy of the GFET layout patterning process steps can improve the performance uniformity, their impact on the GFET performance variability should be considered and compared to that of the channel length. In this work, we assess the impact of the fabrication-related tolerances of GFET-base amplifier geometrical parameters on the RF performance, in terms of the amplifier transit frequency and maximum oscillation frequency, by using a design-of-experiments approach.

Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications

2016 ◽  
Vol 13 (2) ◽  
pp. 39-50 ◽  
Author(s):  
Zheng Chen ◽  
Yiying Yao ◽  
Wenli Zhang ◽  
Dushan Boroyevich ◽  
Khai Ngo ◽  
...  
Keyword(s):  
High Temperature ◽  
High Frequency ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Operating Temperature ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Packaging Materials ◽  
Temperature Capability ◽  
Effect Transistor

This article presents a 1,200-V, 120-A silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) phase-leg module capable of operating at 200°C ambient temperature. Paralleling six 20-A MOSFET bare dice for each switch, this module outperforms the commercial SiC modules in higher operating temperature and lower package parasitics at a comparable power rating. The module's high-temperature capability is validated through the extensive characterizations of the SiC MOSFET, as well as the careful selections of suitable packaging materials. Particularly, the sealed-step-edge technology is implemented on the direct-bonded-copper substrates to improve the module's thermal cycling lifetime. Though still based on the regular wire-bond structure, the module is able to achieve over 40% reduction in the switching loop inductance compared with a commercial SiC module by optimizing its internal layout. By further embedding decoupling capacitors directly on the substrates, the module also allows SiC MOSFETs to be switched twice faster with only one-third turn-off overvoltages compared with the commercial module.

High Frequency Performance of Diamond Field-Effect Transistor

2001 ◽  
Author(s):  
Hirotada Taniuchi ◽  
Hitoshi Umezawa ◽  
Hiroaki Ishizaka ◽  
Takuya Arima ◽  
Hiroshi Kawarada
Keyword(s):  
High Frequency ◽  
Field Effect ◽  
Field Effect Transistor ◽  
Effect Transistor ◽  
High Frequency Performance
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