Quantitative temperature distribution measurements by non-contact scanning thermal microscopy using Wollaston probes under ambient conditions

2020 ◽  
Vol 91 (1) ◽  
pp. 014901 ◽  
Author(s):  
Yun Zhang ◽  
Wenkai Zhu ◽  
Liang Han ◽  
Theodorian Borca-Tasciuc
Author(s):  
E.X.W. Wu ◽  
X.H. Zheng ◽  
J.C.H. Phang ◽  
L.J. Balk ◽  
J.R. Lloyd

Abstract In this paper, the temperature distributions around interconnect defects due to electromigration are presented. A method to overlay the temperature distribution over the optical microscope image of the physical defect has also been developed. This allows a direct correlation of the temperature distribution and the physical structure of the defect.


2013 ◽  
Vol 1557 ◽  
Author(s):  
Ali Assy ◽  
Séverine Gomès ◽  
Stéphane Lefèvre ◽  
Pierre-Olivier Chapuis

ABSTRACTScanning Thermal Microscopy measurements with a resistive microprobe electrically heated were performed for different probe temperatures, for probe free in air and in contact with various specimens. The measured relative difference of Joule power dissipated in the probe when tip is in contact with a sample and when it is free in air is studied for different magnitude of the electrical current that heats the probe. A variation of this signal, never outlined before, is observed. A predictive modeling is used to explain these results and identify from the experimental data the global thermal conductance of the probe-sample thermal exchange for experiments performed in ambient conditions.


2021 ◽  
pp. 102971
Author(s):  
Kavan Zarei ◽  
Mansour Lahonian ◽  
Saman Aminian ◽  
Sasan Saedi ◽  
Mehdi Ashjaee

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 491
Author(s):  
Christoph Metzke ◽  
Fabian Kühnel ◽  
Jonas Weber ◽  
Günther Benstetter

New micro- and nanoscale devices require electrically isolating materials with specific thermal properties. One option to characterize these thermal properties is the atomic force microscopy (AFM)-based scanning thermal microscopy (SThM) technique. It enables qualitative mapping of local thermal conductivities of ultrathin films. To fully understand and correctly interpret the results of practical SThM measurements, it is essential to have detailed knowledge about the heat transfer process between the probe and the sample. However, little can be found in the literature so far. Therefore, this work focuses on theoretical SThM studies of ultrathin films with anisotropic thermal properties such as hexagonal boron nitride (h-BN) and compares the results with a bulk silicon (Si) sample. Energy fluxes from the probe to the sample between 0.6 µW and 126.8 µW are found for different cases with a tip radius of approximately 300 nm. A present thermal interface resistance (TIR) between bulk Si and ultrathin h-BN on top can fully suppress a further heat penetration. The time until heat propagation within the sample is stationary is found to be below 1 µs, which may justify higher tip velocities in practical SThM investigations of up to 20 µms−1. It is also demonstrated that there is almost no influence of convection and radiation, whereas a possible TIR between probe and sample must be considered.


Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.


Author(s):  
Jonathan L. Height ◽  
Burl A. Donaldson ◽  
Walter Gill ◽  
Christian G. Parigger

The study of aluminum particle ignition in an open atmosphere propellant burn is of particular interest when considering accident scenarios for rockets carrying high-value payloads. This study investigates the temperature of an open atmosphere Atlas V solid propellant burn as a function of height from the burning surface. Two instruments were used to infer this temperature: a two-color pyrometer and a spectrometer. The spectra were fitted to a model of energy states for aluminum monoxide. The temperature which provided the best match between the model and data was taken as the reaction temperature. Emissions above 30 inches from the surface of the propellant were not sufficiently strong for data reduction, perhaps obscured by the alumina smoke cloud. The temperature distribution in the plume increased slightly with distance from the burning surface, presumably indicating the delay in ignition and heat release from the larger aluminum particles in the propellant. The pyrometer and spectrometer results were found to be in excellent agreement indicating plume temperatures in the range of 2300K to 3000K.


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