Enhanced diffusion of boron by oxygen precipitation in heavily boron-doped silicon

2017 ◽  
Vol 121 (21) ◽  
pp. 215103 ◽  
Author(s):  
Kazuhisa Torigoe ◽  
Toshiaki Ono
1987 ◽  
Vol 51 (11) ◽  
pp. 849-851 ◽  
Author(s):  
H. L. Tsai ◽  
A. E. Stephens ◽  
F. O. Meyer

2007 ◽  
Vol 131-133 ◽  
pp. 167-174 ◽  
Author(s):  
Lukas Válek ◽  
Jan Šik ◽  
David Lysáček

An unusual pattern of the Oxidation Induced Stacking Faults (OISF) in the heavily boron-doped silicon is reported. Instead of the commonly reported simple OISF ring, we observe a banded OISF pattern. The pattern reflects the distribution of residual vacancies as it is described by Voronkov and Falster [J. Crystal Growth 204 (1999) 462]. We show that the oxygen precipitates in the L- and H- bands grow to an abnormally large size during the crystal growth and which serve as the OISF nuclei during subsequent wafer oxidation. It is concluded that a combination of the high boron, oxygen and vacancy concentration is responsible for the enhanced oxygen precipitation during the crystal growth.


2014 ◽  
Vol 116 (19) ◽  
pp. 193503 ◽  
Author(s):  
Kazuhisa Torigoe ◽  
Jun Fujise ◽  
Toshiaki Ono ◽  
Kozo Nakamura

1991 ◽  
Vol 24 (5) ◽  
pp. 576-580 ◽  
Author(s):  
S. Gupta ◽  
S. Messoloras ◽  
J. R. Schneider ◽  
R. J. Stewart ◽  
W. Zulehner

Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.


2010 ◽  
Vol 484 (4-6) ◽  
pp. 258-260 ◽  
Author(s):  
D.D.D. Ma ◽  
K.S. Chan ◽  
D.M. Chen ◽  
S.T. Lee

Solar RRL ◽  
2021 ◽  
Author(s):  
Bruno Vicari Stefani ◽  
Moonyong Kim ◽  
Matthew Wright ◽  
Anastasia Soeriyadi ◽  
Dmitriy Andronikov ◽  
...  

2017 ◽  
Vol 457 ◽  
pp. 325-330 ◽  
Author(s):  
Stephan Haringer ◽  
Daniela Gambaro ◽  
Maria Porrini

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