Challenges in probabilistic timing model generation in integrated circuits

2016 ◽  
Author(s):  
Naresh Kumar ◽  
Parag Bhatnagar ◽  
N. K. Agarwal ◽  
P. S. Bhatnagar
Keyword(s):  
Integrated Circuits ◽  
Model Generation ◽  
Timing Model ◽  
Probabilistic Timing

Logic depth aware context independent timing model generation

2016 ◽  
Author(s):  
Parag Bhatnagar ◽  
Naresh Kumar ◽  
P. S. Bhatnagar ◽  
N. K. Agarwal
Keyword(s):  
Model Generation ◽  
Timing Model

Automated timing model generation

2002 ◽  
Author(s):  
Ajay J. Daga ◽  
Loa Mize ◽  
Subramanyam Sripada ◽  
Chris Wolff ◽  
Qiuyang Wu
Keyword(s):  
Model Generation ◽  
Timing Model

scholarly journals Automatic Timing Model Generation by CFG Partitioning and Model Checking

2005 ◽  
Author(s):  
I. Wenzel ◽  
B. Rieder ◽  
R. Kirner ◽  
P. Puschner
Keyword(s):  
Model Checking ◽  
Model Generation ◽  
Timing Model

Concurrent multi-mode timing model generation for hierarchical timing analysis

2016 ◽  
Author(s):  
Naresh Kumar ◽  
Parag Bhatnagar ◽  
N. K. Agarwal ◽  
P. S. Bhatnagar
Keyword(s):  
Timing Analysis ◽  
Model Generation ◽  
Timing Model ◽  
Hierarchical Timing ◽  
Multi Mode

Automated timing model generation

2002 ◽  
Author(s):  
A.J. Daga ◽  
L. Mize ◽  
S. Sripada ◽  
C. Wolff ◽  
Qiuyang Wu
Keyword(s):  
Model Generation ◽  
Timing Model

Some applications of electron beam microanalysis techniques in VLSI process evaluation

1983 ◽  
Vol 41 ◽  
pp. 160-161
Author(s):  
Simon Thomas
Keyword(s):  
Integrated Circuits ◽  
Process Evaluation ◽  
Large Scale ◽  
Technology Development ◽  
Analytical Techniques ◽  
Successful Implementation ◽  
Analysis Of Failures ◽  
Characterization Of Materials ◽  
Circuits Vlsi

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.

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