scholarly journals Correlative transmission electron microscopy and electrical properties study of switchable phase-change random access memory line cells

2015 ◽  
Vol 117 (6) ◽  
pp. 064504 ◽  
Author(s):  
J. L. M. Oosthoek ◽  
F. C. Voogt ◽  
K. Attenborough ◽  
M. A. Verheijen ◽  
G. A. M. Hurkx ◽  
...  
2002 ◽  
Vol 737 ◽  
Author(s):  
Wei Zhao ◽  
Steve Graca

ABSTRACTWith the introduction of high aspect ratio and steep geometries in deep-subquarter-micron dynamic random access memory (DRAM) device, it becomes more and more critical to understand the formation of undesired intermetallic Ti-Al phases in Al-metallization and thus better-control the profile of interconnectors. In this article, Ti-related inclusions in Metal 1 (M1) interconnecting layer (an AlCu-0.5% alloy) originated from the bottom Ti liner were characterized with an Analytical TEM. Samples were cleaved from nanometer 256Mbit dynamic random access memory DRAM devices. The TEM employed is a JEOL 2010F with a field emission gun (FEG) and running at 200KV acceleration voltage. Correlations among transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM), electron energy loss spectroscopy (EELS) elemental mapping, and x-ray energy dispersive spectroscopy (XEDS) elemental linescan were established. The results here not only provide important feedbacks to semiconductor product integration and optimization, but also demonstrate the full-functionality of the start-of-the-art analytical TEM in investigations of nanometer semiconductor devices.


Author(s):  
Phil Schani ◽  
S. Subramanian ◽  
Vince Soorholtz ◽  
Pat Liston ◽  
Jamey Moss ◽  
...  

Abstract Temperature sensitive single bit failures at wafer level testing on 0.4µm Fast Static Random Access Memory (FSRAM) devices are analyzed. Top down deprocessing and planar Transmission Electron Microscopy (TEM) analyses show a unique dislocation in the substrate to be the cause of these failures. The dislocation always occurs at the exact same location within the bitcell layout with respect to the single bit failing data state. The dislocation is believed to be associated with buried contact processing used in this type of bitcell layout.


2012 ◽  
Vol 45 (37) ◽  
pp. 375302 ◽  
Author(s):  
Guoxiang Wang ◽  
Xiang Shen ◽  
Qiuhua Nie ◽  
Rongping Wang ◽  
Liangcai Wu ◽  
...  

2006 ◽  
Vol 23 (1) ◽  
pp. 172-174 ◽  
Author(s):  
Qiao Bao-Wei ◽  
Feng Jie ◽  
Lai Yun-Feng ◽  
Ling Yun ◽  
Lin Yin-Yin ◽  
...  

2005 ◽  
Vol 22 (4) ◽  
pp. 934-937 ◽  
Author(s):  
Xia Ji-Lin ◽  
Liu Bo ◽  
Song Zhi-Tang ◽  
Feng Song-Lin ◽  
Chen Bomy

Nanoscale ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 4678-4684
Author(s):  
Yan Cheng ◽  
Yonghui Zheng ◽  
Zhitang Song

A 3D nano-bicontinuous structure consisting of a reversible Sb2Te3 phase and amorphous Si phase is visualized. The amorphous Si frame is stable and the Sb2Te3 nano areas switch between the a- and f-structure.


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