Coexistence of colossal stress and texture gradients in sputter deposited nanocrystalline ultra-thin metal films

2014 ◽  
Vol 105 (22) ◽  
pp. 221902 ◽  
Author(s):  
Yener Kuru ◽  
Udo Welzel ◽  
Eric J. Mittemeijer
Keyword(s):  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Sputter Deposited

Electrochemical Characterization of Magnetron Sputter-Deposited Nb—Zr Thin Metal Films

CORROSION ◽  
1990 ◽  
Vol 46 (6) ◽  
pp. 499-505 ◽  
Author(s):  
L. Fedrizzi ◽  
Y. Massiani ◽  
J. P. Crousier ◽  
M. Dapor ◽  
P. L. Bonora
Keyword(s):  
Metal Films ◽  
Electrochemical Characterization ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Magnetron Sputter ◽  
Sputter Deposited

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

On the electrocatalytic symbiotic synergism between Pt, Ni and Al in plasma vapour deposited PtxNiyAlz thin metal films for water electrolysis

2021 ◽  
Vol 494 ◽  
pp. 229344
Author(s):  
Roelof J. Kriek ◽  
Liesel A. van Heerden ◽  
Anzel Falch ◽  
Malcolm I. Gillespie ◽  
Alaa Y. Faid ◽  
...  
Keyword(s):  
Water Electrolysis ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films
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