Increased carbon nanotube area density after catalyst generation from cobalt disilicide using a cyclic reactive ion etching approach

2014 ◽  
Vol 115 (14) ◽  
pp. 144302 ◽  
Author(s):  
Rongsi Xie ◽  
Can Zhang ◽  
Bingan Chen ◽  
Marleen van der Veen ◽  
Guofang Zhong ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Reactive Ion Etching ◽  
Cobalt Disilicide ◽  
Ion Etching ◽  
Area Density

scholarly journals Electrochemical Properties of Individual Carbon Nanotube Fabricated by Reactive Ion Etching

2011 ◽  
Vol 21 (2) ◽  
pp. 89-94
Author(s):  
Sook-Hyun Hwang ◽  
Hyon-Kwang Choi ◽  
Sang-Hyo Kim ◽  
Young-Moon Han ◽  
Min-Hyon Jeon
Keyword(s):  
Carbon Nanotube ◽  
Electrochemical Properties ◽  
Reactive Ion Etching ◽  
Ion Etching

High Aspect Ratio Machining of Nanocarbon Materials by Reactive Ion Etching

MRS Advances ◽  
2017 ◽  
Vol 2 (1) ◽  
pp. 9-14
Author(s):  
Atsuko Sekiguchi ◽  
Don N. Futaba ◽  
Takeo Yamada ◽  
Kenji Hata
Keyword(s):  
Carbon Nanotube ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reactive Ion Etching ◽  
Thick Layer ◽  
Lateral Resolution ◽  
Ion Etching ◽  
Deep Etching ◽  
Nanocarbon Materials ◽  
Micrometer Scale

AbstractWe demonstrate anisotropic, vertical deep etching of graphite and densely packed carbon nanotube (CNT) thick layer beyond the micrometer scale, which representing the first step toward nanocarbon bulk micromachining. This micromachining process is compatible with standard lithography and therefore allows the fabrication of graphite and CNT architectures with 1 μm lateral resolution and up to 10 μm scale depth.

Magnetron Reactive Ion Etching of GaAs and AIGaAs in CH4/H2/Ar Plasmas.

1996 ◽  
Author(s):  
George F. McLane ◽  
Paul Cooke ◽  
Robert P. Moerkirk
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching

Modification of the n-Surface Profile of AlGaInN LEDs by Changing the Gas-Mixture Composition During Reactive Ion Etching

2020 ◽  
Vol 54 (6) ◽  
pp. 672-676
Author(s):  
L. K. Markov ◽  
I. P. Smirnova ◽  
M. V. Kukushkin ◽  
A. S. Pavluchenko
Keyword(s):  
Reactive Ion Etching ◽  
Surface Profile ◽  
Mixture Composition ◽  
Gas Mixture ◽  
Ion Etching

Reactive ion etching of III-V compounds using C2H6/H2

1988 ◽  
Vol 24 (13) ◽  
pp. 798 ◽  
Author(s):  
T. Matsui ◽  
H. Sugimoto ◽  
T. Ohishi ◽  
H. Ogata
Keyword(s):  
Reactive Ion Etching ◽  
Ion Etching

GaInAsP/InP mass transport laser monolithically integrated with photodetector using reactive ion etching

1989 ◽  
Vol 25 (15) ◽  
pp. 954 ◽  
Author(s):  
T. Matsui ◽  
H. Sugimoto ◽  
K. Ohtsuka ◽  
Y. Abe ◽  
H. Ogata
Keyword(s):  
Mass Transport ◽  
Reactive Ion Etching ◽  
Ion Etching ◽  
Monolithically Integrated

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

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