Degradation of AlGaN/GaN high electron mobility transistors related to hot electrons

2012 ◽  
Vol 100 (23) ◽  
pp. 233508 ◽  
Author(s):  
Matteo Meneghini ◽  
Antonio Stocco ◽  
Riccardo Silvestri ◽  
Gaudenzio Meneghesso ◽  
Enrico Zanoni
2015 ◽  
Vol 106 (21) ◽  
pp. 213502 ◽  
Author(s):  
Tommaso Brazzini ◽  
Michael A. Casbon ◽  
Huarui Sun ◽  
Michael J. Uren ◽  
Jonathan Lees ◽  
...  

1996 ◽  
Vol 69 (10) ◽  
pp. 1411-1413 ◽  
Author(s):  
Gaudenzio Meneghesso ◽  
Alessandro Paccagnella ◽  
Youcef Haddab ◽  
Claudio Canali ◽  
Enrico Zanoni

2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  

Author(s):  
Yu-Chen Lai ◽  
Yi-Nan Zhong ◽  
Ming-Yan Tsai ◽  
Yue-Ming Hsin

AbstractThis study investigated the gate capacitance and off-state characteristics of 650-V enhancement-mode p-GaN gate AlGaN/GaN high-electron-mobility transistors after various degrees of gate stress bias. A significant change was observed in the on-state capacitance when the gate stress bias was greater than 6 V. The corresponding threshold voltage exhibited a positive shift at low gate stress and a negative shift when the gate stress was greater than 6 V, which agreed with the shift observation from the I–V measurement. Moreover, the off-state leakage current increased significantly after the gate stress exceeded 6 V during the off-state characterization although the devices could be biased up to 1000 V without breakdown. The increase in the off-state leakage current would lead to higher power loss.


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