On the relative contribution of temperature, moisture and vapor pressure to delamination in a plastic IC package during lead-free solder reflow

2005 ◽  
Author(s):  
Hu Guojun ◽  
A.A.O. Tay
Keyword(s):  
Vapor Pressure ◽  
Lead Free ◽  
Lead Free Solder ◽  
Relative Contribution ◽  
Solder Reflow ◽  
Free Solder ◽  
Ic Package

Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly

2010 ◽  
Vol 2010 (1) ◽  
pp. 000156-000163
Author(s):  
Weijun Zhou ◽  
Quan Yuan ◽  
Chris Li ◽  
Stephen F. Hahn ◽  
Kurt A. Koppi ◽  
...  
Keyword(s):  
Block Copolymers ◽  
Dimensional Stability ◽  
Moisture Absorption ◽  
Lead Free ◽  
Lead Free Solder ◽  
Optical Polymers ◽  
Reflow Process ◽  
Short Period ◽  
Solder Reflow ◽  
Free Solder

A new class of thermoplastic optical polymers made by substantially fully hydrogenating block copolymers of styrene and butadiene, known as cyclic block copolymers (CBCs), were recently discovered to exhibit lead-free solder reflow resistance with peak reflow temperature up to 260°C. This kind of behavior is uncommon for traditional thermoplastic polymers. The block copolymer design and the resulting nanostructured morphology lead to strong elastic and soft solid material characteristics for CBC, which may explain why CBCs can maintain good dimensional stability at high temperatures (i.e., above its glass transition temperature, Tg) for a short period of time such as in a solder reflow process. This hypothesis was examined by computational fluid dynamics modeling on a molded CBC lens of LUXEON K2 LED package configuration. When the CBC lens is subjected to a simulated solder reflow process, the change in physical dimension due to thermal expansion and gravity effects is predicted to be negligible. However, the residual stress in the molded lens may play a profound role on its dimensional stability. There exists a critical stress value below which no observable deformation is predicted for the CBC lens. With excellent optical transparency and good long term optical stability, low moisture absorption, and good injection moldability, CBCs is a promising class of materials for LED packaging that contributes to improved LED manufacturing economics.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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