Processing factor dependence of resistivity parameters of ruthenate-based thick film resistors with low temperature coefficients

1998 ◽  
Vol 84 (5) ◽  
pp. 2913-2919 ◽  
Author(s):  
Gary M. Crosbie ◽  
F. Johnson ◽  
W. Trela
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Processing Factor ◽  
Temperature Coefficients

scholarly journals THE EFFECT OF RENNIN UPON CASEIN

1927 ◽  
Vol 10 (6) ◽  
pp. 987-1005 ◽  
Author(s):  
Vladimir Pertzoff
Keyword(s):  
Low Temperature ◽  
Free Enzyme ◽  
The Other ◽  
Temperature Coefficients ◽  
Temperature Levels ◽  
Two Temperature

1. The preparation and purification of paracasein was described and certain criteria for the absence of free enzyme provided for. 2. The solubility of purified paracasein in water at low temperature was studied, and found practically identical with the solubility of casein. 3. The capacity of paracasein to bind base was investigated by means of its solubility in NaOH at 5° and at 23° ± 2°C., and found to be distinctly different from that of casein. 4. At these two temperature levels paracasein had a 1.5 greater capacity to bind base than casein. The equivalent combining weights of paracasein and casein were found to stand each to the other, apapproximately, as 2 to 3. 5. This relationship suggested that the temperature coefficients of the solubility of paracasein and casein in NaOH are identical. 6. This evidence indicates that paracasein is a modification of casein, distinguishable by physicochemical means.

Sensor stack for Tian-Calvet Calorimeter made in LTCC-Technology

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000019-000023
Author(s):  
Franz Schubert ◽  
Jaroslaw Kita ◽  
Michael Gollner ◽  
Florian Linseis ◽  
Ralf Moos
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Production Costs ◽  
Hybrid Structures ◽  
Fem Modelling ◽  
Stage Of Development ◽  
Ceramic Disc ◽  
Made In ◽  
Calvet Calorimeter ◽  
Screen Printed

Abstract The paper presents the construction and first tests of a new sensor stack for a Tian-Calvet Calorimeter made in LTCC Technology. In contrast to typical construction where wired thermocouples are directly connected, the here-presented solution replaces wired thermocouples by screen-printed thick-film thermocouples placed on a structured disc made of Low Temperature Co-fired Ceramics (LTCC). The advantage of screen-printed thermocouples is the ease of integration of them into thick-film hybrid structures, and to simplify the device setup. Moreover, using thermocouples integrated into a ceramic disc can increase the sensitivity of the system and simultaneously reduce the production costs. The paper shows the design and fabrication of the sensor stacks. It consists of several LTCC discs and ceramic spacers. On each LTCC disc, 34 Au/Pt thermocouples were deposited. The design of the disc was supported by FEM-modelling under consideration of device specific requirements. The very initial measurements, which we conducted using two sensor stacks already exhibited a sensitivity of 8 μV/mW, which is more than satisfactory in this stage of development.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering Processes

2014 ◽  
Vol 2014 (1) ◽  
pp. 000251-000257
Author(s):  
Steven Grabey ◽  
Samson Shahbazi ◽  
Sarah Groman ◽  
Catherine Munoz
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Elevated Temperatures ◽  
Printed Electronics ◽  
High Reliability ◽  
Sem Analysis ◽  
Lead Free ◽  
Sac305 Solder ◽  
Soldering Process ◽  
Lead Free Solders

An increased interest in low temperature polymer thick film products has become apparent due to the rise of the printed electronics market. The specifications for these products are becoming more demanding with expectations that the low temperature products should perform at a level that is typically reserved for their high temperature counterparts; including solderability with lead free solders, high reliability and strong adhesion. Traditionally, it has only been possible to use leaded solders for soldering to polymer based thick film conductors. Over the last 15 years environmental concerns and legislation have pushed the industry towards a lead free approach. The shift to lead free solders, while beneficial, provides new challenges during processing. The high temperatures required for a lead-free soldering process yield a naturally harsher environment for polymer thick film pastes. In the past these conditions have proven too harsh for the pastes to survive. The polymer thick film discussed in this document aims to address some of these concerns for a highly reliable and easy to process polymer thick film paste. Due to the poor leaching characteristics of polymer thick films, at elevated temperatures, the predecessors of this paste typically soldered at low temperatures with leaded solders. The goal of this paper is to present a low temperature paste that is compatible with a variety of substrates and readily accepts lead-free solder. This paper will discuss a newly formulated low temperature curing (150°C – 200°C) RoHS and REACH compliant paste that shows excellent solderability with SAC305 solder. The paste was evaluated using a dip soldering method at 235°C–250°C on a variety of substrates. The data presented includes solder acceptance, adhesion data, thermal analysis and SEM analysis.

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