Magnetic domains of single-crystal Nd2Fe14B imaged by unmodified scanning electron microscopy

1998 ◽  
Vol 83 (11) ◽  
pp. 6843-6845 ◽  
Author(s):  
L. H. Lewis ◽  
J.-Y. Wang ◽  
P. Canfield
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Single Crystal ◽  
Magnetic Domains ◽  
Scanning Electron

Scanning electron microscopy with polarization analysis: An update

1991 ◽  
Vol 49 ◽  
pp. 764-765
Author(s):  
J. Unguris ◽  
M. W. Hart ◽  
R. J. Celotta ◽  
D. T. Pierce
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Domain Walls ◽  
Domain Wall Motion ◽  
Optical Recording ◽  
Polarization Analysis ◽  
Magnetic Domains ◽  
Magnetic Microstructure ◽  
Domain Structures ◽  
Scanning Electron

Over the past ten years the technique of scanning electron microscopy with polarization analysis (SEMPA) has rapidly evolved from a scientific curiosity to a useful analytical tool for looking at a material's magnetic microstructure. Several reviews of the technique have been published elsewhere. SEMPA has been successfully used to analyze various technological problems such as: noise in magnetic and magneto-optical recording media, domain wall motion in thin film recording heads, and domain structures in small Permalloy shapes. Basic science applications of SEMPA include quantitative studies of the influence of the surface on the structure of magnetic domains and domain walls, and studies of magnetic microstructures in ultra-thin (0.1 - 1 nm) ferromagnetic films. Many current applications of SEMPA make use of the technique's surface sensitivity to probe the magnetism of thin films and multilayers.

Technique for Visualizing Subgrain Structure at Fatigue Crack Tips by Ion Etching and Scanning Electron Microscopy

1973 ◽  
Vol 31 ◽  
pp. 86-87 ◽  
Author(s):  
G. G. Shaw ◽  
D. K. Benson
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Fatigue Crack ◽  
Single Crystal ◽  
Fatigue Cracks ◽  
Subgrain Structure ◽  
Ion Etching ◽  
Etch Patterns ◽  
Crack Tips ◽  
Scanning Electron

The subgrain structure in ram size areas adjacent to fatigue cracks has been observed by ion etching followed by scanning electron microscopy. The etch patterns have been definitely identified as subgrain structure resulting from the fatigue strains by direct comparison with channelling electron microscopy. The technique is described as it was applied to a single crystal of aluminum which had been fatigued in Stage I by reversed bending.A 5 mm long section of crystal containing the crack was cut from the fatigue sample by spark machining. This section was sliced into pieces 2 to 3 mm thick, and a slice selected with the crack tip close to its center. The selected slice was placed in a shallow aluminum cup about 2 cm in diameter.

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