scholarly journals Design, Fabrication, and Testing of a Monolithically Integrated Tri-Axis High-Shock Accelerometer in Single (111)-Silicon Wafer

Micromachines ◽  
2019 ◽  
Vol 10 (4) ◽  
pp. 227
Author(s):  
Shengran Cai ◽  
Wei Li ◽  
Hongshuo Zou ◽  
Haifei Bao ◽  
Kun Zhang ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Fabrication Process ◽  
Single Chip ◽  
Micro Fabrication ◽  
Monolithically Integrated ◽  
Shock Testing ◽  
High Shock ◽  
Cantilever Structure ◽  
Micro Systems

In this paper, a monolithic tri-axis piezoresistive high-shock accelerometer has been proposed that has been single-sided fabricated in a single (111)-silicon wafer. A single-cantilever structure and two dual-cantilever structures are designed and micromachined in one (111)-silicon chip to detect Z-axis and X-/Y-axis high-shock accelerations, respectively. Unlike the previous tri-axis sensors where the X-/Y-axis structure was different from the Z-axis one, the herein used similar cantilever sensing structures for tri-axis sensing facilitates design of uniform performance among the three elements for different sensing axes and simplifies micro-fabrication for the multi-axis sensing structure. Attributed to the tri-axis sensors formed by using the single-wafer single-sided fabrication process, the sensor is mechanically robust enough to endure the harsh high-g shocking environment and can be compatibly batch-fabricated in standard semiconductor foundries. After the single-sided process to form the sensor, the untouched chip backside facilitates simple and reliable die-bond packaging. The high-shock testing results of the fabricated sensor show linear sensing outputs along X-/Y-axis and Z-axis, with the sensitivities (under DC 5 V supply) as about 0.80–0.88 μV/g and 1.36 μV/g, respectively. Being advantageous in single-chip compact integration of the tri-axis accelerometers, the proposed monolithic tri-axis sensors are promising to be embedded into detection micro-systems for high-shock measurement applications.

scholarly journals 2020 IUPAC-ThalesNano Prize In Flow Chemistry and Microfluidics–Call For Nominations

2020 ◽  
Vol 42 (2) ◽  
pp. 26-26
Keyword(s):  
Systems Engineering ◽  
Flow Chemistry ◽  
Outstanding Contribution ◽  
Micro Fabrication ◽  
Micro Systems

Abstract The IUPAC-ThalesNano Prize in Flow Chemistry and Microfluidics is to be awarded to an internationally recognized scientist, whose activities or published accounts have made an outstanding contribution in the field of flow chemistry, microfluidics, micro fabrication, and micro systems engineering in academia or industry. Nomination materials should be submitted by 31 May 2020 by visiting the website.

Fabrication of Ultra Thick Ferromagnetic Structures in Silicon

2004 ◽  
Author(s):  
Debbie G. Jones ◽  
Albert P. Pisano
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Saturation Magnetization ◽  
Silicon Wafer ◽  
Fabrication Process ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Scanning Electron

A novel fabrication process is presented to create ultra thick ferromagnetic structures in silicon. The structures are fabricated by electroforming NiFe into silicon templates patterned with deep reactive ion etching (DRIE). Thin films are deposited into photoresist molds for characterization of an electroplating cell. Results show that electroplated films with a saturation magnetization above 1.6 tesla and compositions of approximately 50/50 NiFe can be obtained through agitation of the electrolyte. Scanning electron microscopy (SEM) images show that NiFe structures embedded in a 500 μm thick silicon wafer are realized and the roughening of the mold sidewalls during the DRIE aids in adhesion of the NiFe to the silicon.

Autonomous Control of Non-Silicon MEMS Flexible Micro-Assembly Line

2014 ◽  
Vol 496-500 ◽  
pp. 1468-1472
Author(s):  
Gao Yang Zhang ◽  
Xin Jin ◽  
Zhi Jing Zhang
Keyword(s):  
Assembly Line ◽  
High Volume ◽  
Research Community ◽  
Autonomous Control ◽  
Assembly System ◽  
Micro Fabrication ◽  
Micro Assembly ◽  
Wide Range ◽  
Micro Systems ◽  
Real Challenge

A wide range of micro-components can today be produced using various micro-fabrication techniques. The efficient high volume assembly of complex micro-systems consisting of vast single components (i.e., hybrid micro-systems) is, however, a difficult task that is seen to be a real challenge for the robotic research community. It is necessary to conceive flexible, highly precise and fast micro-assembly methods. In this paper, a frame of a micro-assembly system in the form of flexible micro-assembly line and its autonomous control is presented. Implementation of the control system are described and the procedure of autonomous control is described as well.

Study on Design and Fabrication of Micro-Pyrotechnical Actuator

2014 ◽  
Vol 1055 ◽  
pp. 213-217
Author(s):  
Rui Zhen Xie ◽  
Lan Liu ◽  
Xiao Ming Ren ◽  
Yan Xue ◽  
Lin Sun ◽  
...  
Keyword(s):  
Energetic Materials ◽  
Small Volume ◽  
Low Energy ◽  
Fabrication Process ◽  
Considerable Progress ◽  
Detailed Design ◽  
Micro Systems

Combustion of energetic materials is an attractive means of obtaining a large quantity of energy from a small volume. And these materials can be integrated into functional micro-systems in a manner compatible with micro-system technologies, then micro-pyrotechnics could help to make considerable progress in the field of micro-actuation . In this paper,a micro-pyrotechnical actuator was designed and fabricated. Detailed design and fabrication process of each part of actuator were presented, and the integration is described. Its operation was validated by experimentation. The firing performance is excellent for low-energy ignition requirement.

scholarly journals Fabrication of a CMOS-based Imaging Chip with Monolithically Integrated RGB and NIR Filters

Proceedings ◽  
2019 ◽  
Vol 2 (13) ◽  
pp. 751
Author(s):  
Bart Vereecke ◽  
Els Van Besien ◽  
Deniz Sabuncuoglu Tezcan ◽  
Nick Spooren ◽  
Nicolaas Tack ◽  
...  
Keyword(s):  
Bandpass Filter ◽  
Imaging System ◽  
Low Cost ◽  
Cmos Technology ◽  
Image Sensors ◽  
Single Chip ◽  
Interference Filters ◽  
Monolithically Integrated ◽  
Recent Developments

Recent developments in multispectral cameras have demonstrated how compact and low-cost spectral sensors can be made by monolithically integrating filters on top of commercially available image sensors. In this paper, the fabrication of a RGB + NIR variation to such a single-chip imaging system is described, including the integration of a metallic shield to minimize crosstalk, and two interference filters: a NIR blocking filter, and a NIR bandpass filter. This is then combined with standard polymer based RGB colour filters. Fabrication of this chip is done in imec’s 200 mm cleanroom using standard CMOS technology, except for the addition of RGB colour filters and microlenses, which is outsourced.

scholarly journals Monolithically Integrated Diffused Silicon Two-Zone Heaters for Silicon-Pyrex Glass Microreactors for Production of Nanoparticles: Heat Exchange Aspects

Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 818
Author(s):  
Milena Rašljić Rafajilović ◽  
Katarina Radulović ◽  
Milče M. Smiljanić ◽  
Žarko Lazić ◽  
Zoran Jakšić ◽  
...  
Keyword(s):  
High Temperature ◽  
Silicon Wafer ◽  
Titanium Dioxide Nanoparticles ◽  
Pyrex Glass ◽  
High Resistivity ◽  
Glass Wafer ◽  
Monolithically Integrated ◽  
Different Temperatures ◽  
And Performance ◽  
P Type

We present the design, simulation, fabrication and characterization of monolithically integrated high resistivity p-type boron-diffused silicon two-zone heaters in a model high temperature microreactor intended for nanoparticle fabrication. We used a finite element method for simulations of the heaters’ operation and performance. Our experimental model reactor structure consisted of a silicon wafer anodically bonded to a Pyrex glass wafer with an isotropically etched serpentine microchannels network. We fabricated two separate spiral heaters with different temperatures, mutually thermally isolated by barrier apertures etched throughout the silicon wafer. The heaters were characterized by electric measurements and by infrared thermal vision. The obtained results show that our proposed procedure for the heater fabrication is robust, stable and controllable, with a decreased sensitivity to random variations of fabrication process parameters. Compared to metallic or polysilicon heaters typically integrated into microreactors, our approach offers improved control over heater characteristics through adjustment of the Boron doping level and profile. Our microreactor is intended to produce titanium dioxide nanoparticles, but it could be also used to fabricate nanoparticles in different materials as well, with various parameters and geometries. Our method can be generally applied to other high-temperature microsystems.

Design of an Integrated SiC JFET Power Switch and Flyback Diode

2012 ◽  
Vol 717-720 ◽  
pp. 1041-1044
Author(s):  
Rahul Radhakrishnan ◽  
Jian Hui Zhao
Keyword(s):  
High Voltage ◽  
Fabrication Process ◽  
Monolithically Integrated ◽  
Surface Field ◽  
Power Switch ◽  
Integrated Device ◽  
D Model

In this paper, we describe the design of a high voltage SiC VJFET monolithically integrated with a JBS diode. The integrated device that was demonstrated up to 834 V in forward blocking doesn’t add any steps to the VJFET fabrication process. While the diode and VJFET share the same surface field termination mechanism, they are partially isolated using implanted field rings. We describe TCAD based optimization of the dimensions of these field rings and outline the design of the JBS diode using a fully analytical 2-D model.

scholarly journals Micro-fabrication process for small transport devices of layered manganite

2012 ◽  
Vol 111 (7) ◽  
pp. 07E129 ◽  
Author(s):  
A. A. Omrani ◽  
G. Deng ◽  
A. Radenovic ◽  
A. Kis ◽  
H. M. Rønnow
Keyword(s):  
Fabrication Process ◽  
Micro Fabrication
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