High‐flux low‐energy (≂20 eV) N+2ion irradiation during TiN deposition by reactive magnetron sputtering: Effects on microstructure and preferred orientation

1995 ◽  
Vol 78 (9) ◽  
pp. 5395-5403 ◽  
Author(s):  
L. Hultman ◽  
J.‐E. Sundgren ◽  
J. E. Greene ◽  
D. B. Bergstrom ◽  
I. Petrov
Keyword(s):  
Magnetron Sputtering ◽  
Preferred Orientation ◽  
Low Energy ◽  
Reactive Magnetron Sputtering ◽  
High Flux ◽  
Reactive Magnetron

Preferred orientation and film structure of TaN films deposited by reactive magnetron sputtering

2004 ◽  
Vol 22 (2) ◽  
pp. 332-338 ◽  
Author(s):  
Suguru Noda ◽  
Kun Tepsanongsuk ◽  
Yoshiko Tsuji ◽  
Yuya Kajikawa ◽  
Yoshifumi Ogawa ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Film Structure ◽  
Preferred Orientation ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron

Characterization of Titanium Nitride Films Prepared by DC Reactive Magnetron Sputtering at Different Deposition Time

2007 ◽  
Author(s):  
Kai Yang ◽  
Jianqing Jiang ◽  
Mingyuan Gu
Keyword(s):  
Magnetron Sputtering ◽  
Film Thickness ◽  
Titanium Nitride ◽  
Deposition Time ◽  
Adhesive Property ◽  
Preferred Orientation ◽  
Reactive Magnetron Sputtering ◽  
Reactive Magnetron ◽  
Tin Films ◽  
Dc Reactive Magnetron Sputtering

Titanium nitride (TiN) films were grown on Si (111) and 95W18Cr4V high-speed steel substrates using DC reactive magnetron sputtering technique with different deposition time. The changes in crystal growth orientation of the TiN films were measured by X-ray diffraction (XRD). The surface & cross-sectional morphologies of TiN films were analyzed using field emission scanning electron microscopy (FESEM). The hardness and adhesive property of TiN films were evaluated as well. It is found that the increase of the film thickness favors the formation of the {111} preferred orientation of TiN films. When the {111} preferred orientation is presented, TiN films exhibit a kind of surface morphology of triangular pyramid with right angles. With the increase of the film thickness, the columnar grains continuously grow lengthwise and breadthwise. The size of grains influences the hardness of TiN films more greatly. The adhesive property of the film/substrate interface decreased with increasing film thickness.

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