Misfit dislocation formation at heterointerfaces in (Al,In)GaN heteroepitaxial layers grown on semipolar free-standing GaN substrates

2011 ◽  
Vol 109 (3) ◽  
pp. 033505 ◽  
Author(s):  
F. Wu ◽  
A. Tyagi ◽  
E. C. Young ◽  
A. E. Romanov ◽  
K. Fujito ◽  
...  
2015 ◽  
Vol 54 (11) ◽  
pp. 115501 ◽  
Author(s):  
Motoaki Iwaya ◽  
Taiji Yamamoto ◽  
Daisuke Iida ◽  
Yasunari Kondo ◽  
Mihoko Sowa ◽  
...  

1995 ◽  
Vol 399 ◽  
Author(s):  
A.G. Cullis

ABSTRACTThe manner in which misfit strain can influence the morphology of heteroepitaxial layers is reviewed. Following a brief consideration of theoretical modelling, examples of experimental observations for two important materials systems, SiGe/Si and InGaAs/GaAs, are given. It is demonstrated that the formation of undulations of specific types is driven by partial elastic stress-relief and a lowering of the system free energy. Under these conditions, islands of deposit can be formed during initial growth and ripples can be produced upon continuous layers. Furthermore, the presence of surface morphological distortions and the accompanying strain fluctuations also can have a significant impact upon misfit dislocation introduction. Relationships between these fluctuations and dislocation source behaviour are described.


1978 ◽  
Vol 45 (2) ◽  
pp. 377-385 ◽  
Author(s):  
V. V. Kalinin ◽  
N. N. Gerasimenko ◽  
S. I. Stenin

1998 ◽  
Vol 411 (3) ◽  
pp. L865-L871 ◽  
Author(s):  
Dimitrios Maroudas ◽  
Luis A. Zepeda-Ruiz ◽  
W.Henry Weinberg

2000 ◽  
Vol 209 (4) ◽  
pp. 716-723 ◽  
Author(s):  
H. Fukuto ◽  
P. Feichtinger ◽  
G.D. U'Ren ◽  
S. Lindo ◽  
M.S. Goorsky ◽  
...  

1993 ◽  
Vol 8 (7) ◽  
pp. 1572-1577 ◽  
Author(s):  
J.P. Hirth

Strained multilayers composed of two misfitting layers and a third, thin interlayer are considered. With appropriate intermediate lattice parameters for the interlayer, the latter is shown to stabilize the structure with respect to misfit dislocation formation. Cases of misfit corresponding both to balanced biaxial stress and to pure shear stress in the interface are treated.


2004 ◽  
Vol 96 (12) ◽  
pp. 7087-7094 ◽  
Author(s):  
J. A. Floro ◽  
D. M. Follstaedt ◽  
P. Provencio ◽  
S. J. Hearne ◽  
S. R. Lee

2012 ◽  
Vol 717-720 ◽  
pp. 313-318 ◽  
Author(s):  
Xuan Zhang ◽  
Tetsuya Miyazawa ◽  
Hidekazu Tsuchida

Thermal annealing experiments were performed to determine the critical conditions of misfit dislocation formation in 4H-SiC epilayers in a temperature range of 1400-1800 °C. Misfit dislocations were observed to form at a given annealing temperature if the temperature gradient across the epi-wafer exceeded a critical value. It was also found that two types of interfacial dislocations could form under different stress conditions. Their formation mechanisms are discussed.


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