Effect of input power and gas pressure on the roughening and selective etching of SiO2/Si surfaces in reactive plasmas
2014 ◽
Vol 21
(04)
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pp. 1450056
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1962 ◽
Vol 13
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pp. 147-152
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1995 ◽
Vol 53
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pp. 232-233
1995 ◽
Vol 53
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pp. 62-63
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1993 ◽
Vol 51
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pp. 154-155
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1917 ◽
Vol 83
(2162supp)
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pp. 361-361
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2015 ◽
Vol 135
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pp. 19-26
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