The self‐biased heterojunction effect of ferroelectric thin film on silicon substrate

1990 ◽  
Vol 67 (6) ◽  
pp. 2985-2991 ◽  
Author(s):  
Yuhuan Xu ◽  
Ching Jih Chen ◽  
Ren Xu ◽  
John D. Mackenzie
Keyword(s):  
Thin Film ◽  
Silicon Substrate ◽  
Ferroelectric Thin Film ◽  
The Self

Effect of Forming Gas on Properties of SrBi2Ta2O9 Ferroelectric Thin Film and Powder

2009 ◽  
Vol 24 (4) ◽  
pp. 737-740 ◽  
Author(s):  
Dong-Sheng WANG ◽  
Tao YU ◽  
An HU ◽  
Di WU ◽  
Ai-Dong LI ◽  
...  
Keyword(s):  
Thin Film ◽  
Ferroelectric Thin Film

scholarly journals Binary Self-Assembly of Nanocolloidal Arrays using Concurrent and Sequential Spin Coating Techniques

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 274
Author(s):  
Shih-Jyun Shen ◽  
Demei Lee ◽  
Yu-Chen Wu ◽  
Shih-Jung Liu
Keyword(s):  
Silicon Substrate ◽  
Self Assembly ◽  
Spin Coating ◽  
Processing Parameters ◽  
The Self ◽  
Silicon Substrates ◽  
Processing Conditions ◽  
Polystyrene Spheres ◽  
Optimal Processing ◽  
Spin Coater

This paper reports the binary colloid assembly of nanospheres using spin coating techniques. Polystyrene spheres with sizes of 900 and 100 nm were assembled on top of silicon substrates utilizing a spin coater. Two different spin coating processes, namely concurrent and sequential coatings, were employed. For the concurrent spin coating, 900 and 100 nm colloidal nanospheres of latex were first mixed and then simultaneously spin coated onto the silicon substrate. On the other hand, the sequential coating process first created a monolayer of a 900 nm nanosphere array on the silicon substrate, followed by the spin coating of another layer of a 100 nm colloidal array on top of the 900 nm array. The influence of the processing parameters, including the type of surfactant, spin speed, and spin time, on the self-assembly of the binary colloidal array were explored. The empirical outcomes show that by employing the optimal processing conditions, binary colloidal arrays can be achieved by both the concurrent and sequential spin coating processes.

Modeling the influence of the seeding layer on the transition behavior of a ferroelectric thin film

2011 ◽  
Vol 520 (1) ◽  
pp. 646-650 ◽  
Author(s):  
A. Oubelkacem ◽  
I. Essaoudi ◽  
A. Ainane ◽  
M. Saber ◽  
F. Dujardin
Keyword(s):  
Thin Film ◽  
Ferroelectric Thin Film ◽  
Seeding Layer ◽  
Transition Behavior

Substrate-induced mechanical and dielectric properties of a ferroelectric thin film

2002 ◽  
Vol 91 (8) ◽  
pp. 4973-4982 ◽  
Author(s):  
L. Lahoche ◽  
V. Lorman ◽  
S. B. Rochal ◽  
J. M. Roelandt
Keyword(s):  
Thin Film ◽  
Dielectric Properties ◽  
Ferroelectric Thin Film

Influence of the silicon substrate thickness on the response of thin film pyroelectric detectors

2002 ◽  
Vol 46 (8) ◽  
pp. 1155-1161 ◽  
Author(s):  
Jong Soo Ko ◽  
Weiguo Liu ◽  
Weiguang Zhu ◽  
Byung Man Kwak
Keyword(s):  
Thin Film ◽  
Silicon Substrate ◽  
Substrate Thickness ◽  
Pyroelectric Detectors

Experimental Measurement and Analysis of Microelectronics Application Polymer Materials Properties

1992 ◽  
Vol 264 ◽  
Author(s):  
Y.H. Jeng ◽  
Mirng-Ji Lii
Keyword(s):  
Thin Film ◽  
Material Properties ◽  
Silicon Substrate ◽  
Coupling Effect ◽  
Measurement Techniques ◽  
Epoxy Adhesive ◽  
Polymer Materials ◽  
Fea Model ◽  
Curvature Measurement ◽  
Substrate Curvature

AbstractA laser based surface scanning technique was utilized to measure the polyimide coated silicon wafer curvature resulting from thermal cycling and mismatch, Meanwhile, mechanical properties of polyimide thin film were characterized by DMA, TMA and tensile test. Based on the obtained material properties, A FEA model was developed to analyze the experimental results -reasonable correlation was obtained.Similar approaches were taken one step further in the MCM silicon substrate curvature measurement. In a MCM package with silicon substrate, epoxy adhesive, and ceramic package, substrate warpage was developed in a thermal cycle due to thermal mismatch between the substrate and the package and coupling effect linked by epoxy adhesive. Three different substrate curvature measurement techniques were applied to identify the substrate curvature and epoxy thin film properties were also well characterized. A 3D FEA model incorporating with the epoxy material properties was developed to analyze the substrate warpage and investigate an optimal package design.

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