Oxygen distribution in silicon‐on‐insulator layers obtained by zone melting recrystallization

1990 ◽  
Vol 67 (12) ◽  
pp. 7337-7347 ◽  
Author(s):  
P. W. Mertens ◽  
J. Leclair ◽  
H. E. Maes ◽  
W. Vandervorst
1989 ◽  
Vol 157 ◽  
Author(s):  
Paul W. Mertens ◽  
Herman E. Maes

ABSTRACTIn zone melting recrystallization (ZMR) of thin silicon films different mechanisms can lead to thickness variations of the obtained silicon film. In this paper we will concentrate on some of these phenomena. One is the large scale mass transport, which typically leads to a thinned region at the start of the ZMR process. Another one, which is to a certain extent related to the first one, is the typical ripple formation that occurs especially under conditions that are commonly referred to as “low thermal gradient” regime.


1992 ◽  
Vol 139 (9) ◽  
pp. 2687-2695 ◽  
Author(s):  
I. N. Miaoulis ◽  
P. Y. Wong ◽  
S. M. Yoon ◽  
R. D. Robinson ◽  
C. K. Hess

1983 ◽  
Vol 23 ◽  
Author(s):  
John C. C. Fan ◽  
B-Y. Tsaur ◽  
C. K. Chen ◽  
J. R. Dick ◽  
L. L. Kazmerski

ABSTRACTUsing secondary-ion mass spectroscopy, we have found that oxygen is strongly concentrated at the sub-boundaries in zone-melting-recrystallized silicon-on-insulator films prepared by the graphite-strip-heater technique. This observation suggests that the formation of sub-boundaries during recrystallization may be caused by constitutional supercooling resulting from the presence of oxygen that is dissolved into the molten Si zone from the adjacent SiO2 layers. Since all zone-melting-recrystallized films to date have been bordered by SiO2 layers, regardless of the heating techniques employed, the sub-boundaries almost always present in these films may well have dissolved oxygen as their common origin.


1987 ◽  
Vol 51 (5) ◽  
pp. 343-345 ◽  
Author(s):  
J. Narayan ◽  
S. Y. Kim ◽  
K. Vedam ◽  
R. Manukonda

1989 ◽  
Vol 97 (3-4) ◽  
pp. 599-606
Author(s):  
M.J.J. Theunissen ◽  
A.H. Goemans ◽  
A.J.R. De Kock ◽  
M.L.J. Geijselaers

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