Dopant redistribution during the solid‐phase growth of CrSi2on Si(100)

1988 ◽  
Vol 64 (8) ◽  
pp. 4187-4193 ◽  
Author(s):  
A. Rockett ◽  
J. E. Greene ◽  
H. Jiang ◽  
M. Östling ◽  
C. S. Petersson
2013 ◽  
Vol 753 ◽  
pp. 505-509
Author(s):  
Yuichi Sato ◽  
Toshifumi Suzuki ◽  
Hiroyuki Mogami ◽  
Fumito Otake ◽  
Hirotoshi Hatori ◽  
...  

Solid phase growth of thin films of copper (Cu), aluminum (Al) and zinc oxide (ZnO) on single crystalline sapphire and quartz glass substrates were tried by heat-treatments and their crystallization conditions were investigated. ZnO thin films relatively easily recrystallized even when they were deposited on the amorphous quartz glass substrate. On the other hand, Cu and Al thin films hardly recrystallized when they were deposited on the quartz glass substrate. The metal thin films could be recrystallized at only extremely narrow windows of the heat-treatment conditions when they were deposited on the single crystalline sapphire substrate. The window of the solid phase heteroepitaxial growth condition of the Al film was wider than that of the Cu film.


2013 ◽  
Vol 535-536 ◽  
pp. 89-93 ◽  
Author(s):  
Alexander V. Manzhirov

Phase transitions can be usually observed in nature and technology which effectively utilize certain types of these transitions. An approach to modeling phase transition processes on the basis of the mathematical theory of growing solids is developed. Liquid-solid and gas-solid phase transitions are under consideration. Main attention is paid to the processes of solid phase growth and deformation.


2003 ◽  
Vol 16 (3-4) ◽  
pp. 505-508 ◽  
Author(s):  
Y. Murakami ◽  
H. Kido ◽  
A. Kenjo ◽  
T. Sadoh ◽  
T. Yoshitake ◽  
...  

2006 ◽  
Vol 51 (19) ◽  
pp. 3969-3978
Author(s):  
M.A. Pasquale ◽  
S.L. Marchiano ◽  
J.L. Vicente ◽  
A.J. Arvia

2013 ◽  
Vol 10 (12) ◽  
pp. 1708-1711 ◽  
Author(s):  
Takashi Ikehata ◽  
Tatsuya Ando ◽  
Takuya Yamamoto ◽  
Yuta Takagi ◽  
Naoyuki Sato ◽  
...  

1982 ◽  
Vol 13 ◽  
Author(s):  
J.S. Williams

ABSTRACTThis paper provides a brief overview of the application of transient annealing to the removal of ion implantation damage and dopant activation in GaAs. It is shown that both the liquid phase and solid phase annealing processes are more complex in GaAs than those observed in Si. Particular attention is given to observations of damage removal, surface dissociation, dopant redistribution, solubility and the electrical properties of GaAs. The various annealing mechanisms are discussed and areas in need of further investigation are identified.


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