Direct measurement of small diffusion coefficients with secondary ion mass spectroscopy

1982 ◽  
Vol 53 (11) ◽  
pp. 7551-7557 ◽  
Author(s):  
M.‐P. Macht ◽  
V. Naundorf
2004 ◽  
Vol 809 ◽  
Author(s):  
Mudith S. A. Karunaratne ◽  
Janet M. Bonar ◽  
Jing Zhang ◽  
Arthur F. W. Willoughby

ABSTRACTIn this paper, we compare B diffusion in epitaxial Si, Si with 0.1%C, SiGe with 11% Ge and SiGe:C with 11%Ge and 0.1%C at 1000°C under interstitial, vacancy and non-injection annealing conditions. Diffusion coefficients of B in each material were extracted by computer simulation, using secondary ion mass spectroscopy (SIMS) profiles obtained from samples before and after annealing.Interstitial injection enhances B diffusion considerably in all materials compared to inert annealing. In samples which experienced vacancy injection, B diffusion was suppressed. The results are consistent with the view that B diffusion in these materials occurs primarily via interstitialcy type defects.


1993 ◽  
Vol 316 ◽  
Author(s):  
M. Kuttler ◽  
A. Knecht ◽  
D. Bimberg ◽  
H. Kräutle

ABSTRACTThe redistribution of the dopants Ru and Os implanted into GaAs and InP as well as the structural properties of the hosts are investigated in dependence of the annealing procedure. Results of Rutherford backscattering and secondary-ion-mass-spectroscopy experiments are presented. The RBS results of Os in GaAs annealed at 850°C indicate that an amount of about 1018 cm-3 Os is on substitutional sites. Two different diffusion processes are observed: an uphill diffusion in the amorphized region and a Fick-type diffusion in the tail of the depth profiles. The diffusion coefficients for Ru in GaAs at 850°C and Os in InP at 750°C are estimated to 4*10-14 cm2s-1 and 8*10-15 cm2s-1, respectively.


2002 ◽  
Vol 16 (01n02) ◽  
pp. 100-107 ◽  
Author(s):  
S. W. LOH ◽  
D. H. ZHANG ◽  
C. Y. LI ◽  
R. LIU ◽  
A. T. S. WEE

We have carried out direct diffusion measurements of Cu into Ta and Ta into Cu. Thin films of 50nm thickness of Cu were grown onto a thick Ta layer of 1 μm by Ionized Metal Plasma. Samples were annealed in a rapid thermal system from temperatures ranging from 400°C to 800°C for periods of 60s and 180s. The diffusion profile was performed using Secondary ion mass spectroscopy. The Cu diffusion coefficients in Ta can be described by 3.0246 × 10-15 exp(-0.1747eV/kT) at 60s and 2.7532 × 10-15 exp(-0.1737eV/kT) at 180s. The Ta diffusion coefficients in Cu can be described by 2.7532 × 10-15 exp(-0.1773eV/kT) at 60s and 2.1271 × 10-15 exp(-0.1753eV/kT) at 180s. To assure reliability, the extent of both diffusions should be considered in device design and processing.


Author(s):  
B. K. Furman ◽  
S. Purushothaman ◽  
E. Castellani ◽  
S. Renick ◽  
D. Neugroshl

2010 ◽  
Vol 82 (17) ◽  
Author(s):  
Nobuaki Takahashi ◽  
Teruyasu Mizoguchi ◽  
Tsubasa Nakagawa ◽  
Tetsuya Tohei ◽  
Isao Sakaguchi ◽  
...  

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