Effect of metal contacts on the electrical characteristics of Al2O3 dielectric thin films

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.

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The morphologies and electrical properties of indium contacts on (100) cadmium telluride surfaces

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100131747 ◽

1992 ◽

Vol 50 (2) ◽

pp. 1422-1423

Author(s):

A.M. Letsoalo ◽

M.E. Lee ◽

E.O. de Neijs

Keyword(s):

Electrical Properties ◽

Cadmium Telluride ◽

Methanol Solution ◽

Electrical Characteristics ◽

Metal Contacts ◽

Deposition Technique ◽

Interfacial Layers ◽

Semiconductor Contacts ◽

Grown Single Crystal ◽

Diamond Abrasive

Semiconductor devices require metal contacts for efficient collection of electrical charge. The physics of these metal/semiconductor contacts assumes perfect, abrupt and continuous interfaces between the layers. However, in practice these layers are neither continuous nor abrupt due to poor nucleation conditions and the formation of interfacial layers. The effects of layer thickness, deposition rate and substrate stoichiometry have been previously reported. In this work we will compare the effects of a single deposition technique and multiple depositions on the morphology of indium layers grown on (100) CdTe substrates. The electrical characteristics and specific resistivities of the indium contacts were measured, and their relationships with indium layer morphologies were established.Semi-insulating (100) CdTe samples were cut from Bridgman grown single crystal ingots. The surface of the as-cut slices were mechanically polished using 5μm, 3μm, 1μm and 0,25μm diamond abrasive respectively. This was followed by two minutes immersion in a 5% bromine-methanol solution.

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Fabrication of dielectric thin films by sputtering deposition at different pressures with (Ba0.3Sr0.7)(Zn1/3Nb2/3)O3ceramic as target

International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) ◽

10.3139/146.110557 ◽

2011 ◽

Vol 102 (9) ◽

pp. 1180-1183

Author(s):

Feng Shi

Keyword(s):

Thin Films ◽

Dielectric Thin Films ◽

Sputtering Deposition

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Finite-Element Modeling and Quantitative Measurement Using Scanning Microwave Microscopy to Characterize Dielectric Films

10.31399/asm.cp.istfa2018p0561 ◽

2018 ◽

Author(s):

K. A. Rubin ◽

W. Jolley ◽

Y. Yang

Keyword(s):

Thin Films ◽

Dielectric Film ◽

Dielectric Constants ◽

Dielectric Films ◽

Silicon Substrates ◽

Fem Modeling ◽

Dielectric Thin Films ◽

Microwave Microscopy ◽

Scanning Microwave Microscopy ◽

Low K

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.

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