Realization of a high capacitance density in Bi2Mg2∕3Nb4∕3O7 pyrochlore thin films deposited directly on polymer substrates for embedded capacitor applications

2006 ◽  
Vol 89 (23) ◽  
pp. 232910 ◽  
Author(s):  
Jong-Hyun Park ◽  
Cheng-Ji Xian ◽  
Nak-Jin Seong ◽  
Soon-Gil Yoon ◽  
Seung-Hyun Son ◽  
...  
Keyword(s):  
Thin Films ◽  
Capacitance Density ◽  
Polymer Substrates ◽  
High Capacitance ◽  
Embedded Capacitor

Dielectric Properties of PCB Embedded Bismuth-Zinc-Niobium Films Prepared using RF Magnetron Sputtering

2006 ◽  
Vol 969 ◽  
Author(s):  
Seungeun Lee ◽  
Jung Won Lee ◽  
Inhyung Lee ◽  
Yul Kyo Chung
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Leakage Current ◽  
Printed Circuit Board ◽  
Pyrochlore Structure ◽  
Circuit Board ◽  
Oxygen Plasma Treatment ◽  
Capacitance Density ◽  
Embedded Capacitor

AbstractDielectric properties of bismuth-zinc-niobium oxide (Bi1.5Zn1.0Nb1.5O7, BZN) thin films have been investigated for embedded capacitor. Crystalline BZN has a pyrochlore structure in nature and shows a dielectric constant of ∼ 200 and very low leakage current when crystallized. Since the process temperature is limited to < 200 due to an organic based substrate in printed circuit board, as-deposited BZN film is composed of an amorphous phase, confirmed by XRD analysis. However, it shows remarkably high dielectric constant of 113. It makes BZN to be a proper candidate as a decoupling embedded capacitor in power delivery circuits. Effects of post treatment such as oxygen plasma treatment and low temperature thermal annealing on dielectric properties of BZN thin films are studied. By optimizing deposition conditions, amorphous BZN thin film is well processed in the current PCB process and provides a capacitance density as high as 218 nF/cm2 and leakage current less than 1 μA/cm2 at 3V.

CHARACTERISTICS OF BISMUTH-BASED THIN FILMS DEPOSITED DIRECTLY ON POLYMER SUBSTRATES FOR EMBEDDED CAPACITOR APPLICATION

2007 ◽  
Vol 95 (1) ◽  
pp. 187-195 ◽  
Author(s):  
JUN-KU AHN ◽  
HAE-WON KIM ◽  
KYUNG-CHAN AHN ◽  
SOON-GIL YOON ◽  
SEUNG-HYUN SON ◽  
...  
Keyword(s):  
Thin Films ◽  
Polymer Substrates ◽  
Embedded Capacitor

Fabrication of High Capacitance Density Capacitor Using Spray Coated Ba0.6Sr0.4TiO3 Thin Films

2018 ◽  
Author(s):  
Emmanuel Tetsi ◽  
Isabelle Bord Majek ◽  
Gilles Philippot ◽  
Cyril Aymonier ◽  
Roxan Lemire ◽  
...  
Keyword(s):  
Thin Films ◽  
Capacitance Density ◽  
High Capacitance

High capacitance density by CaCu3Ti4O12 thin films

2010 ◽  
Vol 108 (7) ◽  
pp. 074103 ◽  
Author(s):  
Patrick Fiorenza ◽  
Raffaella Lo Nigro ◽  
Vito Raineri ◽  
Graziella Malandrino ◽  
Roberta G. Toro ◽  
...  
Keyword(s):  
Thin Films ◽  
Capacitance Density ◽  
High Capacitance

Preparation and electrical properties of Bi2Zn2/3Nb4/3O7 thin films deposited at room temperature for embedded capacitor applications

2012 ◽  
Vol 38 ◽  
pp. S73-S77 ◽  
Author(s):  
Xiaohua Zhang ◽  
Wei Ren ◽  
Peng Shi ◽  
M. Saeed Khan ◽  
Xiaofeng Chen ◽  
...  
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Room Temperature ◽  
Embedded Capacitor

Nanomechanical study of thin film nanocomposite and PVD thin films on polymer substrates for optical applications

2013 ◽  
Vol 46 (48) ◽  
pp. 485303 ◽  
Author(s):  
Jonathan Moghal ◽  
Andrew Bird ◽  
Adrian H Harris ◽  
Ben D Beake ◽  
Martin Gardener ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polymer Substrates ◽  
Optical Applications ◽  
Thin Film Nanocomposite

Design, Fabrication, Electrical Characterization and Reliability of Nanomaterials Based Embedded Passives

2010 ◽  
Vol 2010 (1) ◽  
pp. 000847-000854 ◽  
Author(s):  
Rabindra N. Das ◽  
John M. Lauffer ◽  
Steven G. Rosser ◽  
Mark D. Poliks ◽  
Voya R. Markovich
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Electrical Performance ◽  
Large Area ◽  
Capacitance Density ◽  
High Capacitance ◽  
Embedded Passives ◽  
Internal Core ◽  
Embedded Resistors ◽  
Carbon Based

This paper discusses thin film technology based on barium titanate (BaTiO3)-epoxy polymer nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives and their integration in System in a Package (SiP). A variety of nanocomposite thin films ranging from 2 microns to 25 microns thick were processed on PWB substrates by liquid coating or printing processes. SEM micrographs showed uniform particle distribution in the coatings. The electrical performance of composites was characterized by dielectric constant (Dk), capacitance and dissipation factor (loss) measurements. We have designed and fabricated several printed wiring board (PWB) and flip-chip package test vehicles focusing on resistors and capacitors. Two basic capacitor cores were used for this study. One is a layer capacitor. The second capacitor in this case study was discrete capacitor. Resin Coated Copper Capacitive (RC3) nanocomposites were used to fabricate 35 mm substrates with a two by two array of 15mm square isolated epoxy based regions; each having two to six RC3 based embedded capacitance layers. Cores are showing high capacitance density ranging from 15 nF to 30nF depending on Cu area, composition and thickness of the capacitors. In another design, we have used eight layer high density internal core and subsequent fine geometry n (1 to 3) buildup layers to form a n-8-n structure. The eight layer internal core has two resistance layers in the middle and 2 to 6 capacitance layer sequentially applied on the surface. The study also evaluates the resistor materials for embedded passives. Resistors are carbon based pastes and metal based alloys NiCrAlSi. Embedded resistor technology can use either thin film materials, that are applied on the copper foil, or screened carbon based resistor pastes that can achieve any resistor value at any level. For example, combination of 25 ohm per square material and 250 ohm per square material enables resistor ranges from 15 ohms through 30,000 ohms with efficient sizes for the embedded resistors. Similarly, printable resistors can be designed to cover the resistance in the range of 5 ohms to 1 Mohm. The embedded resistors can be laser trimmed to a tolerance of &lt;5% for applications that require tighter tolerance. Reliability of the test vehicles was ascertained by IR-reflow, thermal cycling, PCT (Pressure Cooker Test ) and solder shock. Embedded discrete capacitors were stable after PCT and solder shock. Capacitance change was less than 5% after IR reflow (assembly) preconditioning (3X, 245 °C) and 1400 cycles DTC (Deep Thermal Cycle).

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